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| 3dnand-case.md [2026/05/18 14:50] – [Process steps for the isolation module of 3D-NAND] gauthier.roussilhe.ext | 3dnand-case.md [2026/05/18 16:59] (current) – [Variable steps] gauthier.roussilhe.ext | ||
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| * Oxide CVD | * Oxide CVD | ||
| * Oxide CMP | * Oxide CMP | ||
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| ### 3D NAND channel formation process steps | ### 3D NAND channel formation process steps | ||
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| * PolySi CMP | * PolySi CMP | ||
| * Post-CMP clean | * Post-CMP clean | ||
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| + | |||
| ### Process steps for the isolation module of 3D-NAND | ### Process steps for the isolation module of 3D-NAND | ||
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| ## Process steps count | ## Process steps count | ||
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| ### Fixed steps | ### Fixed steps | ||
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| ### Variable steps | ### Variable steps | ||
| - | The total number of process steps depends of the number of layers on the 3D NAND die. Each layer adds 4 process steps (LELE). The repeating steps for each layer are: | + | The total number of process steps depends of the number of layers on the 3D NAND die. Each layer adds 6 process steps (ONON). The repeating steps for each layer are: |
| * x | * x | ||
| * x | * x | ||
| * x | * x | ||
| * x | * x | ||