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--- back-process-flow.md [2026/05/07 16:26] – arthur
+++ back-process-flow.md [2026/05/07 17:40] (current) – [Categorization] arthur
@@ Line 53: / Line 53: @@
 {{ ::lga-bga-pga.png?600 |}}
 ### Categorization
+**Back end manufacturing** can be categorize between the following groups:
+  * **LGA:** used by Intel for desktop CPUs. Pins are on the motherboard; CPU has flat contacts. Installation involves alignment and pressure.
+  * **PGA:** used by AMD for desktop CPUs. Pins are on the CPU, motherboard has receptacles. Installation involves insertion.
+  * **BGA:** used in mobile devices (laptops, tablets). CPU is soldered directly to the PCB via spherical solder joints. Non-detachable.
+  * **FC-BGA:** more space-efficient; chip is flipped and soldered directly to PCB ((https://www.sinsmarts.com/blog/industrial-computer-cpu-packaging-methods-lga-pga-and-bga-analysis/)).
+  * **WLP(Wafer-Level Packaging):** encapsulation occurs before wafer dicing, it is typically used for very small equipment such as headphones ((https://en.wikipedia.org/wiki/Wafer-level_packaging)).
+Other types of processes exists such as QFN, DFN ((https://en.wikipedia.org/wiki/Flat_no-leads_package)) which are not covered in the first project of naKnow.
+{{ ::typesencap.png?900 |}}
 ## Full process flow for back-end manufacturing