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 **Back end manufacturing** can be categorize between the following groups: **Back end manufacturing** can be categorize between the following groups:
-  * **LGA (Land Grid Array):** used by Intel for desktop CPUs. Pins are on the motherboard; CPU has flat contacts. Installation involves alignment and pressure. +  * **LGA:** used by Intel for desktop CPUs. Pins are on the motherboard; CPU has flat contacts. Installation involves alignment and pressure. 
-  * **PGA (Pin Grid Array):** used by AMD for desktop CPUs. Pins are on the CPU, motherboard has receptacles. Installation involves insertion. +  * **PGA:** used by AMD for desktop CPUs. Pins are on the CPU, motherboard has receptacles. Installation involves insertion. 
-  * **BGA(Ball Grid Array):** used in mobile devices (laptops, tablets). CPU is soldered directly to the PCB via spherical solder joints. Non-detachable. +  * **BGA:** used in mobile devices (laptops, tablets). CPU is soldered directly to the PCB via spherical solder joints. Non-detachable. 
-  * **FC-BGA (Flip-Chip BGA):** more space-efficient; chip is flipped and soldered directly to PCB ((https://www.sinsmarts.com/blog/industrial-computer-cpu-packaging-methods-lga-pga-and-bga-analysis/)).+  * **FC-BGA:** more space-efficient; chip is flipped and soldered directly to PCB ((https://www.sinsmarts.com/blog/industrial-computer-cpu-packaging-methods-lga-pga-and-bga-analysis/)).
   * **WLP(Wafer-Level Packaging):** encapsulation occurs before wafer dicing, it is typically used for very small equipment such as headphones ((https://en.wikipedia.org/wiki/Wafer-level_packaging)).   * **WLP(Wafer-Level Packaging):** encapsulation occurs before wafer dicing, it is typically used for very small equipment such as headphones ((https://en.wikipedia.org/wiki/Wafer-level_packaging)).