Différences

Ci-dessous, les différences entre deux révisions de la page.

--- categorie:page [2025/12/05 17:05] – [What are the main environmental impacts associated to the manufacturing processes?] arthur
+++ categorie:page [2025/12/05 17:30] (Version actuelle) – [Are they different types and technologies?] arthur
@@ Ligne 8: / Ligne 8: @@
 A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. (Wikipédia:https://en.wikipedia.org/wiki/Semiconductor_package)
 ### What is it used for?
-Packaging is necessary for many electronic components like RAMs, CPUs, GPUs, SSDs, etc.
+Packaging is necessary for all electronic components some examples are the RAMs, CPUs, GPUs, SSDs, etc...
 ### Are they different types and technologies?
-Yes there are many different types of semiconductor packaging depending on the machine where the component will be used.
+There are many different types of semiconductor packaging depending on the machine where the component will be used.