Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
Next revision		Previous revision
encapsulation.md [2026/05/07 15:35] – [Encapsulation] arthurencapsulation.md [2026/05/07 16:08] (current) – [Encapsulation] arthur
Line 1: Line 1:
 # Encapsulation # Encapsulation
  
-In order to protect the IC from the external perturbation it has to be encapsulated. There are two ways of doing so : +In electronics, encapsulation refers to the protective housing of a component or circuit to 
-- Molding the IC +shield it from environmental stressors while maintaining necessary electrical connections. ((https://en.wikipedia.org/wiki/Integrated_circuit_packaging)) 
-- Putting a lid (usually a metal one) around the IC+ 
 +There are two ways of encapsulating the IC : 
 +  * Molding 
 +  * Lid 
 + 
 +For processors, encapsulation also serves to increase thermal dissipation surface area. The 
 +CPU can be molded to ensure thermal dissipation or it can be topped with a metal lid, the 
 +second option is usually chosen for large and resources consuming CPUs such as server 
 +ones.  
  
 ## Processes ## Processes