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| encapsulation.md [2026/05/07 15:35] – [Encapsulation] arthur | encapsulation.md [2026/05/07 16:08] (current) – [Encapsulation] arthur | ||
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| # Encapsulation | # Encapsulation | ||
| - | In order to protect | + | In electronics, |
| - | * Molding | + | shield it from environmental stressors while maintaining necessary electrical connections. ((https:// |
| - | * Putting a lid (usually | + | |
| + | There are two ways of encapsulating the IC : | ||
| + | * Molding | ||
| + | * Lid | ||
| + | |||
| + | For processors, encapsulation also serves to increase thermal dissipation surface area. The | ||
| + | CPU can be molded to ensure thermal dissipation or it can be topped with a metal lid, the | ||
| + | second option is usually chosen for large and resources consuming CPUs such as server | ||
| + | ones. | ||
| ## Processes | ## Processes | ||