Differences
This shows you the differences between two versions of the page.
| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| encapsulation.md [2026/05/07 16:02] – [Encapsulation] arthur | encapsulation.md [2026/05/07 16:08] (current) – [Encapsulation] arthur | ||
|---|---|---|---|
| Line 7: | Line 7: | ||
| * Molding | * Molding | ||
| * Lid | * Lid | ||
| + | |||
| + | For processors, encapsulation also serves to increase thermal dissipation surface area. The | ||
| + | CPU can be molded to ensure thermal dissipation or it can be topped with a metal lid, the | ||
| + | second option is usually chosen for large and resources consuming CPUs such as server | ||
| + | ones. | ||
| + | |||
| ## Processes | ## Processes | ||