Differences

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--- intro_wafer [2026/02/02 18:29] – gwenaelle.souffran
+++ intro_wafer [2026/03/30 15:56] (current) – [Manufacturing] gauthier.roussilhe.ext
@@ Line 50: / Line 50: @@
 Negaoctet's datasets, imec tool, Resilio's parametric model
 ### Raw materials
@@ Line 63: / Line 62: @@
 #### Is there mining processes information available?
-TBC
+TB
+C
 ### Manufacturing
-For each system sub-part:
+//For each system sub-part://
 #### What are the manufacturing processes?
+  * [Front-end manufacturing flow](fab-process-flow.md)
+  * [Front-end processes](front-end.md)
 #### What are the assembly processes?
 #### For each process, what is the energy consumption?
@@ Line 119: / Line 123: @@
 Additionally, it is increasingly common for IDMs to outsource part of their production to foundries. Some IDMs, like IBM and Samsung, also offer foundry services to fabless companies.
 ### Where are they located?
@@ Line 217: / Line 220: @@
 TBC
+## Vocabulary
+To help you understand the complexity of semiconductor manufacturing processes, we have created a glossary to bring together key terms and acronyms.
+  * [Glossary](glossary.md)
 ## Bibliography
@@ Line 238: / Line 244: @@
 TBC
 ### What paths/ideas should be explored?
-* Confront Negaoctet's datasets and imec results in order to understand what are the reasons for the differences
+  * Confront Negaoctet's datasets and imec results in order to understand what are the reasons for the differences
+  * Estimate the environmental impact of the wafer packaging [[categorie:page#ici|wafer packaging]]
+### Misc
-* Estimate the environmental impact of the wafer packaging [[categorie:page#ici|wafer packaging]]
+  * [Glossary](glossary.md)