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intro_wafer [2026/05/08 15:35] – [Functional unit and reference flows] gauthier.roussilhe.extintro_wafer [2026/05/13 17:01] (current) – [Database and tools] gauthier.roussilhe.ext
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 **The functional unit is yet to be determined**. **The functional unit is yet to be determined**.
  
-Historically, the environmental footprint of integrated circuit manufacturing has been defined by the following UF: the production of cm² / die. This functional unit is calculated by determining the manufacturing footprint of m² of wafer and then accounting for various losses associated with the kerf, defect density, die format and other yield parameters.+Historically, the environmental footprint of integrated circuit manufacturing has been defined by the following UF: the production of cm²/die. This functional unit is calculated by determining the manufacturing footprint of m² of wafer and then accounting for various losses associated with the kerf, defect density, die format and other yield parameters.
  
 Other proxies may be used to complement a chip’s manufacturing footprint: the number of manufacturing steps[(Weppe, O., Marty, T., Toussaint, S., Brusselmans, N., Prévotet, J. C., Raskin, J. P., & Pelcat, M. (2025, May). Embodied carbon footprint of 3D NAND memories. In Proceedings of the 22nd ACM International Conference on Computing Frontiers: Workshops and Special Sessions (pp. 108-116).)]; the average environmental footprint of each type of process multiplied by the number of steps per process[(Bardon, M. G., Wuytens, P., Ragnarsson, L. Å., Mirabelli, G., Jang, D., Willems, G., ... & Parvais, B. (2020, December). DTCO including sustainability: Power-performance-area-cost-environmental score (PPACE) analysis for logic technologies. In 2020 IEEE International Electron Devices Meeting (IEDM) (pp. 41-4). IEEE.)]; the average footprint based on a fab’s throughput[(Liu, I. Y., Van Winckel, L., Boakes, L., Bardon, M. G., Rolin, C., & Ragnarsson, L. Å. (2024). Modeling the energy consumption of integrated circuit fab infrastructure. IEEE Transactions on Semiconductor Manufacturing, 37(4), 422-427.)]; or a bottom-up approach for analysts with access to primary data from a fab. Other proxies may be used to complement a chip’s manufacturing footprint: the number of manufacturing steps[(Weppe, O., Marty, T., Toussaint, S., Brusselmans, N., Prévotet, J. C., Raskin, J. P., & Pelcat, M. (2025, May). Embodied carbon footprint of 3D NAND memories. In Proceedings of the 22nd ACM International Conference on Computing Frontiers: Workshops and Special Sessions (pp. 108-116).)]; the average environmental footprint of each type of process multiplied by the number of steps per process[(Bardon, M. G., Wuytens, P., Ragnarsson, L. Å., Mirabelli, G., Jang, D., Willems, G., ... & Parvais, B. (2020, December). DTCO including sustainability: Power-performance-area-cost-environmental score (PPACE) analysis for logic technologies. In 2020 IEEE International Electron Devices Meeting (IEDM) (pp. 41-4). IEEE.)]; the average footprint based on a fab’s throughput[(Liu, I. Y., Van Winckel, L., Boakes, L., Bardon, M. G., Rolin, C., & Ragnarsson, L. Å. (2024). Modeling the energy consumption of integrated circuit fab infrastructure. IEEE Transactions on Semiconductor Manufacturing, 37(4), 422-427.)]; or a bottom-up approach for analysts with access to primary data from a fab.
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 #### What are the already existing data (dataset, parametric model, paper, etc.)? #### What are the already existing data (dataset, parametric model, paper, etc.)?
  
-Pirson et al provide a comprehensive review of historical and actual trends regarding environmental impacts of IC production per technology nodes and based on scientific literature and LCA databases[(Pirson, T., Delhaye, T. P., Pip, A. G., Le Brun, G., Raskin, J. P., & Bol, D. (2022). The environmental footprint of IC production: Review, analysis, and lessons from historical trends. IEEE Transactions on Semiconductor Manufacturing, 36(1), 56-67.)].+ 
 +Regarding front-end manufacturing, Pirson et al provide a comprehensive review of historical and actual trends regarding environmental impacts of IC production per technology nodes and based on scientific literature and LCA databases[(Pirson, T., Delhaye, T. P., Pip, A. G., Le Brun, G., Raskin, J. P., & Bol, D. (2022). The environmental footprint of IC production: Review, analysis, and lessons from historical trends. IEEE Transactions on Semiconductor Manufacturing, 36(1), 56-67.)].
  
 <figure right|fig_pirson> <figure right|fig_pirson>
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 </figure> </figure>
  
-Furthermore, several datasets and models already exist, such as:+Furthermore, several datasets and models already exist from LCA databases such as:
   * [[https://codde.fr/en/our-brands/negaoctet|Negaoctet's dataset]]   * [[https://codde.fr/en/our-brands/negaoctet|Negaoctet's dataset]]
-  * [[https://netzero.imec-int.com|imec.netzero app]] 
   * [[https://db.resilio.tech/|Resilio's database]]   * [[https://db.resilio.tech/|Resilio's database]]
 +  * [[https://ecoquery.ecoinvent.org/3.8/cutoff/dataset/579/documentation|ecoinvent]]
 +
 +Several parametric models are also available from industry specialists:
 +  * [[https://netzero.imec-int.com|imec.netzero app]]
 +  * [[https://www.techinsights.com/solutions/semiconductor-manufacturing-carbon-model|TechInsight's Semiconductor Manufacturing Carbon Module]]
 +
 +
  
  
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   * [Back-end manufacturing flow](back-process-flow.md)   * [Back-end manufacturing flow](back-process-flow.md)
   * [Back-end processes](back-end.md)   * [Back-end processes](back-end.md)
 +  * [3D NAND use case](3dnand-case.md)
 +  * [DRAM use case](dram-case.md)