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| life_cycle_analysis [2026/05/19 17:47] – [LCA for Naknow] antoine | life_cycle_analysis [2026/05/19 17:55] (current) – [Methodology for components] antoine | ||
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| ===== LCA for Naknow ===== | ===== LCA for Naknow ===== | ||
| - | ==== Methodology for devices | + | ==== Methodology for components |
| + | Naknow studies 5 components : | ||
| + | * [[intro_wafer|Wafers]] | ||
| + | * [[intro_pcb|PCB]] | ||
| + | * [[intro_screen|Screens]] | ||
| + | * [[intro_hdd|HDD disks]] | ||
| + | * [[intro_optical_sensor|Optical sensors]] | ||
| - | **Declared unit**: 1 piece of equipment of the category under study, during the whole lifespan. | ||
| - | **System boundaries**: | ||
| - | **Approach**: A digital equipment is considered a sum of components (mechanical, electronics, | + | **Fonctional unit** : 1 component, during |
| + | **System boundaries** : Specific to each model. | ||
| - | Each category of equipment or component is defined by one parametric model. For each specific piece of equipment (Laptop X from manufacturer Y), the corresponding model is ‘fed’ with the technical specifications of the equipment to be assessed. Commercial references are also available to prefill the technical specifications of the equipment. | + | **Approach**: |
| + | |||
| + | |||
| + | Each category of component is defined by one parametric model. For each specific piece of equipment (Laptop X from manufacturer Y), the corresponding model is ‘fed’ with the technical specifications of the equipment to be assessed. Commercial references are also available to prefill the technical specifications of the equipment. | ||
| The following approach is applied for the different life cycle stages: | The following approach is applied for the different life cycle stages: | ||
| Line 49: | Line 57: | ||
| === Manufacturing === | === Manufacturing === | ||
| + | ^ **How it works** ^ **Types of parameters** ^ **Types of sources** ^ | ||
| + | | - Breakdown of the equipment into components \\ - Parametric modelling of the environmental impacts of each component \\ - Sum of the impacts of each component | Mass or surface area of material, type of material \\ Technical configuration of equipment (CPU/GPU model, amount of RAM/ | ||
| - | | **How it works** | + | === Distribution === |
| - | | : | + | |
| - | | - Breakdown of the equipment into components - Parametric modelling of the environmental impacts of each component <br> Sum of the impacts of each component | Mass or surface area of material, type of material <br> Technical configuration of equipment (CPU/GPU model, amount of RAM/ | + | |
| - | + | ||
| - | === Distribution: === | + | |
| - | + | ||
| - | + | ||
| - | | **How it works** | + | |
| - | | : | + | |
| - | | - Definition of a typical transport profile for each equipment category (using aeroplane, ship, train, truck) | | + | |
| - | | - Weight of equipment <br> - Distance covered <br> -Type of transport | + | |
| - | | - Scientific literature <br> - LCA and public reports <br> - Databases | + | |
| - | + | ||
| - | - Use: | + | |
| - | | **How it works** | + | ^ **How it works** |
| - | | :----------------------------------------------------------------------------------------------- | : | + | | - Definition of a typical transport profile for each equipment category (using aeroplane, ship, train, truck) |
| - | | - Default average consumption value estimated from the technical specifications | + | |
| - | | - Load rate < | + | |
| - | | - Scientific literature | + | |
| - | - End-of-life: | + | === Use === |
| - | | **How it works** | + | ^ **How it works** |
| - | | : | + | | - Default average consumption value estimated from the technical specifications of the equipment |
| - | | - Definition of end-of-life | + | === End-of-life |
| - | | + | ^ **How it works** ^ **Types of parameters** ^ **Types of sources** ^ |
| - | | + | | - Definition of end-of-life scenarios (recycling, incineration, |
| - | By using a bottom-up approach agnostic of the device manufacturer, | ||
| - | Our main hypothesis is that manufacturer are in fact, assemblers, and that the result of their actions on the final impact is very low. This comes from the very low relative impact of assembly, and the fact that most of the eletronics supply chain is based on the components of a couple of industrial players, all using the same industrial processes. More details are available in our whitepaper [Link to whitepaper]. | ||
| ==== Product Envionnemental Footprint (PEF) method ==== | ==== Product Envionnemental Footprint (PEF) method ==== | ||