# Encapsulation

In electronics, encapsulation refers to the protective housing of a component or circuit to
shield it from environmental stressors while maintaining necessary electrical connections. ((https://en.wikipedia.org/wiki/Integrated_circuit_packaging))

There are two ways of encapsulating the IC :
  * Molding
  * Lid

For processors, encapsulation also serves to increase thermal dissipation surface area. The
CPU can be molded to ensure thermal dissipation or it can be topped with a metal lid, the
second option is usually chosen for large and resources consuming CPUs such as server
ones. 


## Processes

### Molding 

* Plasma clean
* Transfert mold
* Post mold cure

### Lid attach

* Thermal interface application
* Lid attach
* Lid attach cure