3D DRAM manufacturing

Process flow for 3D devices on DRAM

Xiao1) provides the most detailed description of the processes used to manufacture 3D DRAM and NAND devices. Such a detailed public explanation is rare to find and applies only to two types of devices for advanced technology nodes. Nevertheless, it provides a detailed understanding of the various process loops for each mask.

AA Module

Well formation

BWL module

BLC module

BL and peripheral transistor module

SNC, peripheral contact, and M1 process steps

SN module

V1 and M2 process steps

V2 and M3 process steps

V3-M4 and passivation process steps

1)
Xiao, H. (2016). 3D IC Devices, Technologies, and Manufacturing. SPIE press.