**This is an old revision of the document!**
Encapsulation
There are two kinds of encaspulation, we can have modling of plastic or epoxy resin or we can have a metal lid put on top of the IC to encapsulate it.
Processes
Molding
- Plasma clean
- Transfert mold
- Post mold cure
Lid attach
- Thermal interface application
- Lid attach
- Lid attach cure
Discussion