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Encapsulation
In order to protect the IC from the external perturbation it has to be encapsulated.
There are two ways of doing so :
- Molding the IC
- Putting a lid (usually a metal one) around the IC
Processes
Molding
- Plasma clean
- Transfert mold
- Post mold cure
Lid attach
- Thermal interface application
- Lid attach
- Lid attach cure
Discussion