https://lib.naknow.eco/ 2026-07-15T05:56:56+00:00 https://lib.naknow.eco/ https://lib.naknow.eco/lib/exe/fetch.php?media=wiki:logo.svg text/html 2026-06-22T13:28:11+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=3dnand-case.md&rev=1782134891&do=diff 3D NAND manufacturing Intro 3D NAND refers to a type of non-volatile memory (NVM) used globally for data storage (SD cards, SSDs). These devices have a shorter data access time, consume less power, and are more reliable than HDDs due to the absence of moving parts. A flash memory cell is similar to an NMOS transistor: it has a p-well and an n+ source and drain. However, these cells also have a floating gate (FG), a control gate (CG) and an inter-gate dielectric (IGD). The floating gate acts as… text/html 2026-05-06T15:29:07+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=back-end.md&rev=1778081347&do=diff Back-End-of-Line (BEOL) Sequence ---------- 1. Wafer thinning The wafer thinning process is essential for reducing the overall thickness of the silicon substrate to meet the requirements of modern, ultra-thin portable electronics. Processes 1.1. First optical inspection _ text/html 2026-05-07T15:40:33+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=back-process-flow.md&rev=1778168433&do=diff Back-end manufacturing concepts and process flow Context After the dies are tested for functionality and binned, they are packaged. Plastic or ceramic packaging involves mounting the die, connecting the die/bond pads to the pins on the package, and sealing the die. Tiny bondwires are used to connect the pads to the pins. In the 'old days' (1970s), wires were attached by hand, but now specialized machines perform the task. Traditionally, these wires have been composed of gold, leading to a lead… text/html 2026-05-13T13:54:54+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=dram-case.md&rev=1778680494&do=diff 3D DRAM manufacturing Process flow for 3D devices on DRAM Xiao provides the most detailed description of the processes used to manufacture 3D DRAM and NAND devices. Such a detailed public explanation is rare to find and applies only to two types of devices for advanced technology nodes. Nevertheless, it provides a detailed understanding of the various process loops for each mask. text/html 2026-05-07T14:08:09+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=encapsulation.md&rev=1778162889&do=diff Encapsulation In electronics, encapsulation refers to the protective housing of a component or circuit to shield it from environmental stressors while maintaining necessary electrical connections. There are two ways of encapsulating the IC : * Molding text/html 2026-05-13T14:53:10+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=fab-process-flow.md&rev=1778683990&do=diff Front-end manufacturing concepts and process flow Semiconductor manufacturing is among the most complex processes on Earth, if not the most complex. Summarizing the process flow of such an industry in simple terms is difficult given the specific requirements of each type of product produced. text/html 2026-05-31T23:04:29+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=framework_data_governance&rev=1780268669&do=diff Governance Processes and the Lifecycle of Data and Associated Documentation Introduction \ The purpose of this document is to outline the data lifecycle and the associated documentation within the framework of data governance for the naKnow organisation’s knowledge base. Topics covered include the text/html 2026-07-09T19:05:00+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=front-end.md&rev=1783623900&do=diff Front-end processes 1. Cleaning Processes 1.1. RCA clean 1.1.1. Preliminary cleaning The preliminary cleaning step is primordial to kickstart the other cleaning processes. The purpose is to remove large impurities that might be present on the pre-processed wafer. $$ S_x + 2H_2SO_4→ 3SO_2 + 3H_2O $$$$ SiO_2​+6HF→H_2​SiF_6​+2H_2​O $$$$ Cu²⁺ + 4 NH₄OH → [Cu(NH₃)₄]²⁺ + 4 H₂O $$$$ CₓHᵧ + H₂O₂ → CO₂ + H₂O $$$$ M_x + 2HCL→ M_xCL_2 + 2H^+ $$$$ SiO_2 + 4 HF → SiF_4 + H_2O $$$$ H₂SO₄ + H₂O₂… text/html 2026-03-27T15:11:43+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=glossary.md&rev=1774624303&do=diff Glossary Fabrication Fabrication (or Manufacturing)is the process of building circuits on a silicon wafer in a cleanroom environment where all aspects of production (temperature, power, chemistries, moisture, contamination, etc.) are tightly controlled. It take 40 to 150 days to complete the fabrication process. text/html 2026-06-30T11:23:23+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_cmos&rev=1782818603&do=diff Complementary Metal-Oxide-Semiconductor (CMOS) Image Sensor (⚠️WORK IN PROGRESS⚠️) Definition A CMOS sensor (Complementary Metal-Oxide-Semiconductor sensor) is an electronic image sensor that converts light into digital signals using the photodetector principle. Photons are captured and converted into electrons by the photodiode, which are then converted to voltage. An analog-to-digital converter (ADC) then converts this analog information to digital information, which is further processed to … text/html 2026-05-19T10:08:59+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_hdd&rev=1779185339&do=diff HDD System Definition - Goal and scope * HDD = Hard Disk Drive * Storage device that uses magnetic storage to save, store and retrieve data Definition What is it used for? * Save, store and retrieve data * It is permanent storage, unlike volatile memory like RAM. text/html 2026-06-05T08:46:22+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_lcd&rev=1780649182&do=diff Liquid crystal display (LCD) Liquid crystal display, or in short LCD, is a type of display that does not produce its own light. Instead, it uses light from an external source and controls it through optical shutter technology. The main component of an LCD is the liquid crystal (LC), a material that has properties between a liquid and a solid. When electricity is applied, the liquid crystals twist or tilt, controlling how much light passes through polarized filters to create images on the screen… text/html 2026-06-05T14:45:27+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_oled&rev=1780670727&do=diff OLEDs (Organic Light Emitting Diodes) description An OLED (Organic Light-Emitting Diode) is a type of LED whose emissive layer consists of an organic compound film that produces light when an electric current flows through it. This organic layer is sandwiched between two text/html 2026-06-30T09:40:50+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_optical_sensor&rev=1782812450&do=diff Optical sensors System Definition - Goal and scope Definition An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods.$$G_{Fab} = \sum_{i=1}^{N} S_i \cdot (E_i \cdot T_{loc} +K_i)$$ text/html 2026-07-07T13:56:41+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_pcb&rev=1783432601&do=diff Printed Circuit Boards (PCB) A Printed Circuit Board is an electronic component at the center of most electronic devices. It allows the power supply and interconnections of different electronic components. System definition - Goal and scope Definition $15–30/m²$$90–120/m²$$y$$y = 7.81n + 57.97$$n$ text/html 2026-06-30T09:40:16+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_screen&rev=1782812416&do=diff Screen Screens are electronic devices designed to display visual content by creating electronic pictures with illuminated pixels. Each pixel has three separate sub-pixels (red, blue, and green) that are individually controlled to create a color and brightness. text/html 2026-07-07T17:53:10+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=intro_wafer&rev=1783446790&do=diff Wafer WG status This working group focuses on the life cycle inventory of semiconductor manufacturing. We look specifically at wafer and photomask manufacturing, front-end and back-end processes for logic and memory devices . Tasks status WG tracks text/html 2026-06-16T08:45:37+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=life_cycle_assessment&rev=1781599537&do=diff Life Cycle Assessment Definition Life Cycle Assessment (LCA) is a method that assesses the environmental impacts of products or systems. It is the recommended method for environmental display at the European level and standardized at the international level. This method is largely used because of its 3 main characteristics: text/html 2026-06-24T14:36:25+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=modelization-strategy.md&rev=1782311785&do=diff Modelization strategy The aim of this working group is to enable the quantification of the environmental impacts associated with the manufacture of various types of integrated circuits. These manufacturing processes are the most complex in the world, and each manufacturer has its own way of organising production and utilising processes depending on the target devices (logic, RAM, NAND, X nm, X layers, etc.), which constitute their trade secrets. Access to consistent and representative producti… text/html 2026-06-05T21:52:43+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=pcb_manufacturing&rev=1780696363&do=diff Manufacturing processes of multilayer Printed Circuit Boards (PCB) This page aims to explain the manufacturing process flow of multilayer PCB manufacturing. gives an overview of this flow. It is important to note that this flow is adapted depending on the type of PCB (single sided, double sided, or multilayer). text/html 2026-07-06T15:04:12+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=screen_manufacturing&rev=1783350252&do=diff Manufacturing Process of Screens Modern flat-panel display manufacture is a highly precise and coordinated operation that involves making ultra-thin, defect-free glass substrates that serves as the foundation for LCD and OLED displays. Once the glass substrates are ready, the next step depends on the kind of thin film transistor (TFT) backplane technology that is being employed. The TFT backplane acts as the electronic control layer of the display and regulates individual pixels. There are sev… text/html 2026-06-05T09:16:02+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=screen_market&rev=1780650962&do=diff Market outlook on Screen This page is dedicated to describing the screen market, particularly the most prevalent screen technologies. This information is mainly based on market reports and complemented by scientific literature. Market by technology text/html 2026-06-05T08:14:25+00:00 Anonymous (anonymous@undisclosed.example.com) https://lib.naknow.eco/doku.php?id=start&rev=1780647265&do=diff Welcome! Introduction Welcome to naKnow's knowledge base! :) Take a look at DokuWiki manual to learn how to use this tool. List of plugins : LateX caption, Refnotes, MathJax tocsidebar, Discussion A user guide for naKnow's knowledge base will come soon. What is naKnow? naKnow addresses one of the most pressing challenges in today’s digital economy: building transparent, reliable, and actionable environmental intelligence for electronic components. naKnow aims to become an internationa…