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encapsulation.md [2026/05/07 14:37] – created arthurencapsulation.md [2026/05/07 16:08] (current) – [Encapsulation] arthur
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 # Encapsulation # Encapsulation
  
-There are two kinds of encaspulation, we can have modling of plastic or epoxy resin or we can have a metal lid put on top of the IC to encapsulate it.+In electronics, encapsulation refers to the protective housing of a component or circuit to 
 +shield it from environmental stressors while maintaining necessary electrical connections. ((https://en.wikipedia.org/wiki/Integrated_circuit_packaging)) 
 + 
 +There are two ways of encapsulating the IC : 
 +  * Molding 
 +  * Lid 
 + 
 +For processors, encapsulation also serves to increase thermal dissipation surface area. The 
 +CPU can be molded to ensure thermal dissipation or it can be topped with a metal lid, the 
 +second option is usually chosen for large and resources consuming CPUs such as server 
 +ones.  
  
 ## Processes ## Processes