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front-end.md [2026/03/24 16:13] – [Supporting images] gauthier.roussilhe.extfront-end.md [2026/03/24 16:16] (current) – [Supporting images] gauthier.roussilhe.ext
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   * 30% of all front-end processing steps are cleaning steps on average   * 30% of all front-end processing steps are cleaning steps on average
   * Advanced nodes need more cleaning (more layers for advanced memory for instance)   * Advanced nodes need more cleaning (more layers for advanced memory for instance)
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 ### Supporting images ### Supporting images
-[System configuration for Screen WS series](https://hdjp-corporateweb-files-spe.screen.co.jp/6617/1464/0785/product_system.png) 
-  * Legend: QDR: Quick Dump Rising bath ; FR: Final Rinsing bath ; SD: Spin dryer ; EDR: Dump Rinsing bath 
   * [Partial process video from AP&S](https://www.ap-s.de/wp-content/uploads/2022/12/APS-Demo-Center-1.mp4)   * [Partial process video from AP&S](https://www.ap-s.de/wp-content/uploads/2022/12/APS-Demo-Center-1.mp4)
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 +Legend: QDR: Quick Dump Rising bath ; FR: Final Rinsing bath ; SD: Spin dryer ; EDR: Dump Rinsing bath
  
  
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   * A CMOS integrated circuit with embedded memory may require more than 60 implant steps (Applied Materials).   * A CMOS integrated circuit with embedded memory may require more than 60 implant steps (Applied Materials).
   * A large wafer fabricator may process up to 50,000 wafers/month, with each wafer requiring 20 to 30 implants. This output requires the use of about 20 implanters, each with the capacity to implant more than 200 wafers/h (Axcelis).[Link](https://www.axcelis.com/wp-content/uploads/2019/02/Ion_Implantation_in_Silicon_Technology.pdf)   * A large wafer fabricator may process up to 50,000 wafers/month, with each wafer requiring 20 to 30 implants. This output requires the use of about 20 implanters, each with the capacity to implant more than 200 wafers/h (Axcelis).[Link](https://www.axcelis.com/wp-content/uploads/2019/02/Ion_Implantation_in_Silicon_Technology.pdf)
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 ### Supporting images ### Supporting images
-  * Dose and energy requirements of major implantation applications (species shown roughly in 
-order of decreasing usage) (Fig2 here: https://www.axcelis.com/wp-content/uploads/2019/02/Ion_Implantation_in_Silicon_Technology.pdf) 
   * [Axcelis Purion H6   * High Current Ion Implanter](https://www.youtube.com/watch?v=K-qvAKKLQVM)   * [Axcelis Purion H6   * High Current Ion Implanter](https://www.youtube.com/watch?v=K-qvAKKLQVM)
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 #### 8.3. Electrochemical Deposition (ECD) / Plating #### 8.3. Electrochemical Deposition (ECD) / Plating
   * To be defined   * To be defined
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 ### Manufacturers ### Manufacturers
   * [Applied Materials](https://www.appliedmaterials.com/eu/en/product-library.html)   * [Applied Materials](https://www.appliedmaterials.com/eu/en/product-library.html)
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   * [ASM International](https://www.asm.com/)   * [ASM International](https://www.asm.com/)
   * [TEL](https://www.tel.com/)   * [TEL](https://www.tel.com/)
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 ### Equipments ### Equipments
   * LAM [Altus Family](https://www.lamresearch.com/product/altus-product-family/):  CVD (W) and ALD (WN, Mo) processes/ Advanced memory and logic: 3D NAND, DRAM, Interconnect, WN Barrier (via and metallizatio)   * LAM [Altus Family](https://www.lamresearch.com/product/altus-product-family/):  CVD (W) and ALD (WN, Mo) processes/ Advanced memory and logic: 3D NAND, DRAM, Interconnect, WN Barrier (via and metallizatio)
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   * Applied Materials [Endura PVD](https://www.appliedmaterials.com/eu/en/product-library/endura-pvd.html): PVD for metallization   * Applied Materials [Endura PVD](https://www.appliedmaterials.com/eu/en/product-library/endura-pvd.html): PVD for metallization
   * Applied Materials [Versa XLR2 W PVD](https://www.appliedmaterials.com/eu/en/product-library/endura-versa-xlr2-w-pvd.html): PVD (W)   * Applied Materials [Versa XLR2 W PVD](https://www.appliedmaterials.com/eu/en/product-library/endura-versa-xlr2-w-pvd.html): PVD (W)
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 ### Supporting images ### Supporting images
  
-{{:2_process_sequence.jpg?600|}}+{{:2_process_sequence.jpg?800|}}
  
 ### Sources ### Sources
front-end.md.1774365205.txt.gz · Last modified: by gauthier.roussilhe.ext