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--- front-end.md [2026/03/24 16:14] – [Supporting images] gauthier.roussilhe.ext
+++ front-end.md [2026/03/24 16:16] (current) – [Supporting images] gauthier.roussilhe.ext
@@ Line 86: / Line 86: @@
   * 30% of all front-end processing steps are cleaning steps on average
   * Advanced nodes need more cleaning (more layers for advanced memory for instance)
 ### Supporting images
-[System configuration for Screen WS series](https://hdjp-corporateweb-files-spe.screen.co.jp/6617/1464/0785/product_system.png)
-  * Legend: QDR: Quick Dump Rising bath ; FR: Final Rinsing bath ; SD: Spin dryer ; EDR: Dump Rinsing bath
   * [Partial process video from AP&S](https://www.ap-s.de/wp-content/uploads/2022/12/APS-Demo-Center-1.mp4)
+{{:product_system.png?800|}}
+Legend: QDR: Quick Dump Rising bath ; FR: Final Rinsing bath ; SD: Spin dryer ; EDR: Dump Rinsing bath
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 #### 8.3. Electrochemical Deposition (ECD) / Plating
   * To be defined
 ### Manufacturers
   * [Applied Materials](https://www.appliedmaterials.com/eu/en/product-library.html)
@@ Line 530: / Line 530: @@
   * [ASM International](https://www.asm.com/)
   * [TEL](https://www.tel.com/)
 ### Equipments
   * LAM [Altus Family](https://www.lamresearch.com/product/altus-product-family/):  CVD (W) and ALD (WN, Mo) processes/ Advanced memory and logic: 3D NAND, DRAM, Interconnect, WN Barrier (via and metallizatio)
@@ Line 566: / Line 565: @@
   * Applied Materials [Endura PVD](https://www.appliedmaterials.com/eu/en/product-library/endura-pvd.html): PVD for metallization
   * Applied Materials [Versa XLR2 W PVD](https://www.appliedmaterials.com/eu/en/product-library/endura-versa-xlr2-w-pvd.html): PVD (W)
 ### Supporting images
-{{:2_process_sequence.jpg?600|}}
+{{:2_process_sequence.jpg?800|}}
 ### Sources