intro_optical_sensor
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| intro_optical_sensor [2025/11/27 09:34] – louise | intro_optical_sensor [2026/03/16 13:23] (current) – louise | ||
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| # Optical sensors | # Optical sensors | ||
| - | ## System | + | ## System |
| + | ### Definition | ||
| - | * Contact Image Sensor (CIS) = device that detects and converts light rays into electrical signals. | + | * Optical/ |
| - | * Most common type of sensor used in modern digital devices | + | * Context : In smartphones and cameras, the number |
| - | ### What is it used for? | + | #### What is it used for? |
| - | * smartphones, tablets, cameras, etc. | + | They are used in phones, cars, laptops, tablets, |
| - | ### Are they different types and technologies? | + | #### Are there different types/technologies? |
| - | 2 main types : | + | Two main types : |
| * Charge-coupled device (CCD) | * Charge-coupled device (CCD) | ||
| - | * Active-pixel sensor (CMOS sensor) -> cheaper, low electricity consumption | + | * Active-pixel sensor (CMOS sensor) -> cheaper, low electricity consumption. They are more used in modern cameras. |
| + | * IR sensor (for night vision) | ||
| + | CDDs' characteristics: | ||
| - | ## Life cycle | + | * Global shutter |
| + | * Low noise | ||
| + | * High dynamic range | ||
| + | * Medium range frame rates | ||
| + | * Subject to smearing | ||
| - | ### Manufacturing | + | Moderm CMOS characteristics: |
| - | #### What is it made of? | + | * Global shutter and rolling shutter models |
| + | * Low to very low noise | ||
| + | * High to very high dynamic range | ||
| + | * Very high frame rates | ||
| + | * No smearing | ||
| + | |||
| + | #### If different types, what are the differences in terms of materials, process, use consumption? | ||
| TBC | TBC | ||
| - | #### How is it manufactured? | + | #### Is there a generic component that represents a family of components? |
| TBC | TBC | ||
| - | #### Who are the main manufacturers? | + | #### How many sub-parts does the system consist of? |
| + | The main parts of a CMOS image sensor are the following: | ||
| + | |||
| + | * Sensor chip (wafer) | ||
| + | * Wire bonds | ||
| + | * Package | ||
| + | * Cover glass | ||
| + | * Contact pads | ||
| + | |||
| + | Sources : | ||
| + | |||
| + | * [Blog post - Thinklucid](https:// | ||
| + | * [Blog post - Ansys](https:// | ||
| + | |||
| + | |||
| + | ### Perimeter | ||
| + | |||
| + | #### What is included? | ||
| TBC | TBC | ||
| + | #### What is excluded? | ||
| + | TBC | ||
| + | |||
| + | ### Functional unit and reference flows | ||
| + | #### What is the functional unit? | ||
| + | TBC | ||
| + | #### What are the reference flows? | ||
| + | TBC | ||
| + | |||
| - | #### Where are they located? | + | ## Life Cycle - Inventory |
| + | => Goal: Define state of the art on life cycle stages to be considered. | ||
| + | ### Database and tools | ||
| + | #### What are the already existing data (dataset, parametric model, paper, etc.)? | ||
| TBC | TBC | ||
| + | ### Raw materials | ||
| + | => Goal: List the technical information needed for the LCI. | ||
| - | ## Environmental footprint | + | #### What is it made of? |
| + | TBC | ||
| + | #### Who are the main mining? Where are they located? | ||
| + | TBC | ||
| + | #### Is there mining processes information available? | ||
| + | TBC | ||
| + | ### Manufacturing | ||
| + | => Goal: List the technical information needed for the LCI. | ||
| - | ### What are the main environmental impacts associated to the materials? | + | //For each system sub-part:// |
| + | #### What are the manufacturing processes? | ||
| + | TBC | ||
| + | #### What are the assembly processes? | ||
| + | TBC | ||
| + | #### For each process, what is the energy consumption? | ||
| + | TBC | ||
| + | #### For each process, what are the inputs (water, chemicals, etc.) ? | ||
| + | TBC | ||
| + | #### For each process, what is the yield? Are they co-products and/or losses? | ||
| + | TBC | ||
| + | #### How the “main” manufacturers can be characterized: | ||
| TBC | TBC | ||
| - | ### What are the main environmental impacts associated to the manufacturing processes? | + | #### Who are the main manufacturers? |
| + | * Sony corporation (Japan, Integrated Device Manufacturer (IDM)) | ||
| + | * Samsung Electronics (South Korea, IDM) | ||
| + | * OmniVision Technologies (US, fabless) | ||
| + | * onsemi (US, IDM) | ||
| + | * STMicroelectronics (CH, IDM) | ||
| + | |||
| + | [Source](https:// | ||
| + | |||
| + | |||
| + | |||
| + | ### Distribution and packaging | ||
| + | => Goal: List the technical information needed for the LCI. | ||
| + | |||
| + | #### What are the packaging? Made of which materials? | ||
| + | TBC | ||
| + | #### Which are the transport modes? | ||
| + | TBC | ||
| + | #### What are the transport distances? | ||
| TBC | TBC | ||
| - | ### What are the potential parameters affecting environmental impact? | + | ### Use |
| + | => Goal: List the technical information needed for the LCI. | ||
| + | #### What is the service lifespan? (durée d' | ||
| + | TBC | ||
| + | #### Is there a reparation factor? | ||
| + | TBC | ||
| + | #### Is there sub-parts replacement? | ||
| TBC | TBC | ||
| + | #### Where is it used? | ||
| + | TBC | ||
| + | #### Who are the users? | ||
| + | TBC | ||
| + | #### Which + how much energy does it need? | ||
| + | TBC | ||
| + | #### Is there emissions from use? | ||
| + | TBC | ||
| - | ## Next steps | + | ### End of life |
| + | => Goal: List the technical information needed for the LCI. | ||
| - | ### What do we know we don't know? | + | #### What is the lifetime? (durée de vie) |
| + | TBC | ||
| + | #### Is it different from lifespan and why? | ||
| + | TBC | ||
| + | #### Is it refurbished? | ||
| + | TBC | ||
| + | #### Is it recyclable? Can it be dismantled? Which material can be separated? + Where and how? | ||
| + | TBC | ||
| + | #### Is it incinerated with energy recovery? Just incinerated? | ||
| + | TBC | ||
| + | #### Which part of waste can be considered as mismanaged (neither recycled, nor incinerated, | ||
| + | TBC | ||
| + | |||
| + | |||
| + | ## Environmental assessment | ||
| + | => Goal: Define state of the art on environmental impacts. | ||
| + | ### What are the impact assessment methods used (EF, ReCiPe, others)? | ||
| TBC | TBC | ||
| + | ### What are the known environmental impacts associated to the system (indicators)? | ||
| + | TBC | ||
| + | ### What are the known hotspots? Which raw material? Which life stage? | ||
| - | ### What are the identified challenges? | + | * CCD / CMOS |
| + | * Mono / color sensor | ||
| + | * Resolution → sensor size | ||
| + | * Pixel size → sensor size | ||
| + | |||
| + | ### What are the potential parameters affecting environmental impacts? | ||
| + | TBC | ||
| + | ### What are the main source of uncertainty? | ||
| TBC | TBC | ||
| - | ### What paths/ideas should be explored? | ||
| + | ## Bibliography | ||
| + | => Goal: Source every data we cited previously | ||
| + | |||
| + | ### List of our sources | ||
| + | TBC | ||
| + | ### Data origin: bibliographic source / consortium hypothesis / expert opinion - required if a Data Quality Rating (DQR) must be completed | ||
| TBC | TBC | ||
| + | ## Next steps | ||
| + | => Goal: List challenges and clarify priority areas for action | ||
| + | |||
| + | ### What do we know we don't know? | ||
| + | TBC | ||
| + | ### What are the identified challenges? | ||
| + | TBC | ||
| + | ### What paths/ideas should be explored? | ||
| + | TBC | ||
intro_optical_sensor.1764232458.txt.gz · Last modified: by louise