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--- intro_optical_sensor [2026/02/02 19:11] – gwenaelle.souffran
+++ intro_optical_sensor [2026/03/16 13:23] (current) – louise
@@ Line 2: / Line 2: @@
 ## System Definition - Goal and scope
 ### Definition
-* Contact Image Sensor (CIS) = device that detects and converts light rays into electrical signals.
+* Optical/image sensor = device that detects and converts light rays into electrical signals, that can be viewed, analyzed, or stored
-* Most common type of sensor used in modern digital devices
+* Context : In smartphones and cameras, the number of image sensors is increasing. No environmental data available
 #### What is it used for?
-* smartphones, tablets, cameras, etc.
+They are used in phones, cars, laptops, tablets, industrial/medical systems, security cameras, cars and other vehicles, etc.
 #### Are there different types/technologies?
 Two main types :
 * Charge-coupled device (CCD)
-* Active-pixel sensor (CMOS sensor) -> cheaper, low electricity consumption
+* Active-pixel sensor (CMOS sensor) -> cheaper, low electricity consumption. They are more used in modern cameras.
+* IR sensor (for night vision)
+CDDs' characteristics:
+* Global shutter
+* Low noise
+* High dynamic range
+* Medium range frame rates
+* Subject to smearing
+Moderm CMOS characteristics:
+* Global shutter and rolling shutter models
+* Low to very low noise
+* High to very high dynamic range
+* Very high frame rates
+* No smearing
 #### If different types, what are the differences in terms of materials, process, use consumption?
 TBC
 #### Is there a generic component that represents a family of components?
 TBC
 #### How many sub-parts does the system consist of?
-TBC
+The main parts of a CMOS image sensor are the following:
+* Sensor chip (wafer)
+* Wire bonds
+* Package
+* Cover glass
+* Contact pads
+Sources :
+* [Blog post - Thinklucid](https://thinklucid.com/tech-briefs/understanding-digital-image-sensors/)
+* [Blog post - Ansys](https://www.ansys.com/simulation-topics/what-is-cmos-image-sensor)
 ### Perimeter
 #### What is included?
 TBC
@@ Line 53: / Line 89: @@
 #### Is there mining processes information available?
 TBC
 ### Manufacturing
 => Goal: List the technical information needed for the LCI.
@@ Line 71: / Line 106: @@
 #### How the “main” manufacturers can be characterized: by the number of components manufactured, the market share (€), other?
 TBC
 #### Who are the main manufacturers? Where are they located?
-TBC
+* Sony corporation (Japan, Integrated Device Manufacturer (IDM))
+* Samsung Electronics (South Korea, IDM)
+* OmniVision Technologies (US, fabless)
+* onsemi (US, IDM)
+* STMicroelectronics (CH, IDM)
+[Source](https://www.marketsandmarkets.com/ResearchInsight/image-sensor-semiconductor-market.asp#:~:text=Major%20Image%20Sensors%20companies%20include,Components%20Industries%2C%20LLC%20(US)
 ### Distribution and packaging
@@ Line 128: / Line 173: @@
 TBC
 ### What are the known hotspots? Which raw material? Which life stage?
-TBC
+* CCD / CMOS
+* Mono / color sensor
+* Resolution → sensor size
+* Pixel size → sensor size
 ### What are the potential parameters affecting environmental impacts?
 TBC