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intro_optical_sensor [2026/06/02 16:03] – [State of the art: environmental impacts] antoineintro_optical_sensor [2026/06/30 11:40] (current) – [Life Cycle - Inventory] antoine
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-# Optical sensors+======  Optical sensors ====== 
 + 
 + 
 +=====  System Definition - Goal and scope ===== 
 + 
 +====  Definition ====
  
-## System Definition - Goal and scope 
-### Definition 
 An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods. An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods.
  
-The global optical sensor market was worth around \$25–28 billion in 2025 and is expected to reach approximately \$71.7 billion by 2035[[https://www.gminsights.com/industry-analysis/optical-sensor-market]]. This increase is directly linked to progress in automation, imaging and environmental monitoring technologies, as well as to the needs of the automotive, medical and industrial sectors. +The global optical sensor market was worth around \$25–28 billion in 2025 and is expected to reach approximately \$71.7 billion by 2035 [(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])]. This increase is directly linked to progress in automation, imaging and environmental monitoring technologies, as well as to the needs of the automotive, medical and industrial sectors.  
 + 
 + 
 + 
 +==== Function ====
  
-#### What is it used for? 
  
 Thanks to the wide range of optical sensor technologies, a variety of applications are possible. These include consumer electronics, automotive camera systems, industrial machine vision and medical imaging etc. Thanks to the wide range of optical sensor technologies, a variety of applications are possible. These include consumer electronics, automotive camera systems, industrial machine vision and medical imaging etc.
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-#### Are there different types/technologies?+==== Different technologies ==== 
  
 The family of optical sensors is divided into different technology segments, which vary in terms of light sources, detection methods, and applications :  The family of optical sensors is divided into different technology segments, which vary in terms of light sources, detection methods, and applications : 
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 Photoelectric sensors consist of a light emitter and a receiver. The light emitter uses a light-emitting diode (LED) to produce modulated pulses of light. The receivers contain photodiodes that convert the incoming light into electrical signals. These signals are then amplified and processed before being sent to the controller. Photoelectric sensors consist of a light emitter and a receiver. The light emitter uses a light-emitting diode (LED) to produce modulated pulses of light. The receivers contain photodiodes that convert the incoming light into electrical signals. These signals are then amplified and processed before being sent to the controller.
  
-The three most common types of photoelectric sensor are through-beam, retro-reflective and diffuse reflection sensors. https://www.ia.omron.com/support/guide/43/introduction.html+The three most common types of photoelectric sensor are through-beam, retro-reflective and diffuse reflection sensors[(Photoelectric_Sensors > [[https://www.ia.omron.com/support/guide/43/introduction.html]])]. 
  
 Photoelectric sensors are among the most common sensors used in industrial automation. They have many possible applications, including presence detection and safety protection. They can also offer relatively long operational distances for presence detection compared to other sensors. Photoelectric sensors are among the most common sensors used in industrial automation. They have many possible applications, including presence detection and safety protection. They can also offer relatively long operational distances for presence detection compared to other sensors.
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 **Fiber optic sensors** **Fiber optic sensors**
  
-A fiber optic sensor is a device that measures physical conditions using light transmitted through an optical fiber. « Optical signals are transmitted through a glass fiber. If external influences such as temperature, strain, pressure, or vibration change along the fiber or at its end, the measurable properties of the light change » https://www.polytec.com/en/photonics/know-how/fiber-optic-sensor-technology+A fiber optic sensor is a device that measures physical conditions using light transmitted through an optical fiber. « Optical signals are transmitted through a glass fiber. If external influences such as temperature, strain, pressure, or vibration change along the fiber or at its end, the measurable properties of the light change »[(Fiber_Optic_Sensor> [[https://www.polytec.com/en/photonics/know-how/fiber-optic-sensor-technology]])].
  
 The glass fiber acts as the sensor. Therefore, it is electrically insulating and immune to electromagnetic interference and corrosion and is ideal for extreme environments. Fiber optic sensors are mainly used in the industrial, energy, and environmental monitoring sectors. The glass fiber acts as the sensor. Therefore, it is electrically insulating and immune to electromagnetic interference and corrosion and is ideal for extreme environments. Fiber optic sensors are mainly used in the industrial, energy, and environmental monitoring sectors.
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 **Active ranging sensor modules** **Active ranging sensor modules**
  
-An active ranging sensor module is a device that measures the distance to an object by sending out energy and analyzing the signal that comes back, using interferometry, time of flight, or triangulation methods. https://digital-library.theiet.org/doi/10.1049/sbra014e_ch5+An active ranging sensor module is a device that measures the distance to an object by sending out energy and analyzing the signal that comes back, using interferometry, time of flight, or triangulation methods[(Active_Ranging_Sensor> [[https://digital-library.theiet.org/doi/10.1049/sbra014e_ch5]])]. 
  
 The most common types of active ranging sensor modules are ultrasonic sensors, LiDAR (Light Detection and Ranging) and radar sensors. The most common types of active ranging sensor modules are ultrasonic sensors, LiDAR (Light Detection and Ranging) and radar sensors.
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 **Infrared (IR) and Thermal Sensors** **Infrared (IR) and Thermal Sensors**
  
-Infrared (IR) sensors and thermal sensors are generally considered part of the image sensor family, but they operate differently from standard visible-light image sensors. Infrared cameras primarily detect near-infrared light (close to the visible spectrum), while thermal imaging cameras detect mid- and far-infrared radiation (generated by the heat of objects). https://cethermal.com/blogs/cethermal-news/comparison-of-ir-and-thermal-imaging-technologies+Infrared (IR) sensors and thermal sensors are generally considered part of the image sensor family, but they operate differently from standard visible-light image sensors. Infrared cameras primarily detect near-infrared light (close to the visible spectrum), while thermal imaging cameras detect mid- and far-infrared radiation (generated by the heat of objects)[(Infrared_technology> [[https://cethermal.com/blogs/cethermal-news/comparison-of-ir-and-thermal-imaging-technologies]])]. 
  
 They can also be applied to non-imaging sensors technology, such as passive infrared sensors (PIR) for motion detection, gas sensors, spectroscopy detectors and more.  They can also be applied to non-imaging sensors technology, such as passive infrared sensors (PIR) for motion detection, gas sensors, spectroscopy detectors and more. 
  
 +[comment]: <> (
 +===  If different types, what are the differences in terms of materials, process, use consumption? ===
  
-#### If different types, what are the differences in terms of materials, process, use consumption? 
  
 //Question à poser plutôt dans la page wiki d'une famille de capteur optique ex: Image sensors ==> Difference entre [[intro_cmos|CMOS]]/CCD.//  //Question à poser plutôt dans la page wiki d'une famille de capteur optique ex: Image sensors ==> Difference entre [[intro_cmos|CMOS]]/CCD.// 
  
-#### Is there a generic component that represents a family of components?+)
  
-This study will focus on image sensors, which dominate the market for optical sensors https://www.gminsights.com/industry-analysis/optical-sensor-market and are used in many applications, including consumer electronics, automotive camera systems, industrial machine vision, and medical imaging. +====  Focus ====
  
 +
 +This study will focus on image sensors, which dominate the market for optical sensors[(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])] and are used in many applications, including consumer electronics, automotive camera systems, industrial machine vision, and medical imaging. 
 +
 +<figure center |optical_sensor_market>
 {{ :0:global-optical-sensor-market-size-by-product-type-2022-2035-usd-billion.webp |}} {{ :0:global-optical-sensor-market-size-by-product-type-2022-2035-usd-billion.webp |}}
 +<caption>Optical sensor market size by product type </caption>
 +</figure>
  
-POurquoi [[intro_cmos|CMOS]] et pas CCD ?+==== Sub-parts  ====
  
-#### How many sub-parts does the system consist of? 
  
 The main parts of a [[intro_cmos|CMOS]] image sensor are the following: The main parts of a [[intro_cmos|CMOS]] image sensor are the following:
  
-* Sensor chip (wafer, node = 40-180nm): An array of photosensitive pixels, with Bayer pattern +* Microlens : Focus the light and direct it to the photodiode 
-* Wire bonds +* Color filter : Designate light colors 
-* Package +* Photodiode : Absorbs the light and converts it into an electrical charge 
-* Cover glass +* Transisors : Control the signal flow and processing 
-* Contact pads+* Package : Protect the chip and provide connections to the electronics that will use the image. 
  
 +<figure center |CMOS>
 {{:capture_d_ecran_2026-02-04_171919.png?400|}} {{:capture_d_ecran_2026-02-04_171919.png?400|}}
  
 {{:capture_d_ecran_2026-02-18_130801.png?400|}} {{:capture_d_ecran_2026-02-18_130801.png?400|}}
 +<caption> CMOS </caption>
 +</figure>
  
-Interesting sources :+Sources [(understanding_image_sensor > [[https://thinklucid.com/tech-briefs/understanding-digital-image-sensors/ |Blog post - Thinklucid]])]  [(what_is_cmos_image_sensor > [[https://www.ansys.com/simulation-topics/what-is-cmos-image-sensor |Blog post - Ansys]])] [(scaling_cmos_image_sensor > [[https://semiengineering.com/scaling-cmos-image-sensors/#:~:text=Today%2C%20Sony%20is%20the%20largest%20supplier%20of,image%20sensors%2C%20followed%20by%20Samsung%20and%20OmniVision |Scaling CMOS Image Sensors]])] [(electronique_imagerie_101 > [[https://www.edmundoptics.fr/knowledge-center/application-notes/imaging/understanding-camera-sensors-for-machine-vision-applications/ | Électronique d'Imagerie 101 : Compréhension des Capteurs de Caméra pour les Applications de Vision Industrielle]])]
  
-* [Blog post - Thinklucid](https://thinklucid.com/tech-briefs/understanding-digital-image-sensors/) +====  Perimeter ====
-* [Blog post - Ansys](https://www.ansys.com/simulation-topics/what-is-cmos-image-sensor) +
-* [Scaling CMOS Image Sensors](https://semiengineering.com/scaling-cmos-image-sensors/#:~:text=Today%2C%20Sony%20is%20the%20largest%20supplier%20of,image%20sensors%2C%20followed%20by%20Samsung%20and%20OmniVision) +
-* [Électronique d'Imagerie 101 : Compréhension des Capteurs de Caméra pour les Applications de Vision Industrielle](https://www.edmundoptics.fr/knowledge-center/application-notes/imaging/understanding-camera-sensors-for-machine-vision-applications/)+
  
-### Perimeter+===  Included ===
  
-#### What is included? 
  
-Focus on the optical sensor.+This study will focus on the CMOS optical sensor.
  
  
-#### What is excluded?+===  Excluded ===
  
-Exclusion of other sensors like the distance sensor to adjust the focus. 
-Exclusion of the rest of the image-processing system (PCB, controllers, etc.). 
  
-Exclusion of laser sensor and IR sensors. Not the focus for now+Exclusion of other sensors such as Photoelectric sensors, Active ranging sensor modules, Infrared sensors, etc.
  
-### Functional unit and reference flows+Exclusion of the component for the image-processing system (PCB, controllers, etc.).
  
-#### What is the functional unit? +==== Functional unit and reference flows ==== 
-TBC + 
-#### What are the reference flows? + 
-TBC+=== Functional unit=== 
 + 
 +"Manufacture of a CMOS image sensor" 
 + 
 +=== Reference flow === 
 + 
 +One square meter of CMOS image censor. 
 + 
 + 
 +=====  State of the art: environmental impacts ===== 
 + 
 +==== Streamlined Models of CMOS Image Sensors Carbon Impacts ==== 
 +This section summarises the information from Weppe and Al's 2024 study.[([[https://ieeexplore.ieee.org/abstract/document/10741688|O. Weppe, J. Chossat, T. Marty, J. -C. Prévotet and M. Pelcat, "Streamlined Models of CMOS Image Sensors Carbon Impacts," 2024 27th Euromicro Conference on Digital System Design (DSD), Paris, France, 2024, pp. 250-257, doi: 10.1109/DSD64264.2024.00041]])] 
 + 
 +\\ 
 + 
 + 
 +=== Methodology === 
 +Streamlined GHG emission model based on a linear relationship between silicon die surface area and Global Warming Potential (GWP), expressed in gCO<sub>2</sub>eq. The model follows: 
 +$$G_{Fab} = \sum_{i=1}^{N} S_i \cdot (E_i \cdot T_{loc} +K_i)$$ 
 +G<sub>Fab</sub> : Global Warming Potential (GWP) of the fabrication ( gCO<sub>2</sub> eq)\\ 
 +S<sub>i</sub> : the surface of layer i \\ 
 +E<sub>i</sub> : electrical energy consumption of layer i \\ 
 +T<sub>loc</sub> : electrical carbon intensity of the location of fabrication\\ 
 +K<sub>i</sub> : ancillary impact of the layer (infrastructure, factory, chemicals and raw materials) 
 + 
 +The value of K<sub>i</sub> and E<sub>i</sub> are taken from [([[http://link.springer.com/10.1007/978-1-4419-9988-7|S. B. Boyd, Life-Cycle Assessment of Semiconductors. New York, NY: Springer, 2012.]])] 
 + 
 +\\ 
 + 
 + 
 +=== Types of Technologies Covered (System Definition) === 
 +CMOS Image Sensor (CIS). Parameters affecting the scope: 
 +* CCD / CMOS 
 +* Mono / color sensor 
 +* Resolution → sensor size 
 +* Pixel size → sensor size 
 +* Stacking 
 + 
 +\\ 
 + 
 +=== Life Cycle Stages Covered === 
 +* Silicon die fabrication 
 +* Electricity consumption over lifespan 
 + 
 +\\ 
 + 
 +=== Fluxes Included in the Scope === 
 +Generic semiconductor data for a CIS. The following are excluded: 
 +* Lens 
 +* Color filter array 
 +* Other optical components 
 + 
 +\\ 
 + 
 +=== Main Results === 
 +Known hotspots : silicon die manufacturing, electricity consumption over lifespan, 2D/3D die stacking (factor 2 difference) 
 +{{ ::comparasaion_gwp_proposed_models.png?direct&400 |https://ieeexplore.ieee.org/abstract/document/10741688}} 
 + 
 +\\ 
 + 
 +=== Limitations === 
 +Uses generic semiconductor data for a CIS, and therefore does not account for the specificities of CMOS image sensors, such as the lens, the color filter array, or other optical components. 
 + 
 + 
 +=====  Life Cycle - Inventory (⚠️WORK IN PROGRESS⚠️)===== 
 + 
  
  
-## Life Cycle - Inventory 
 => Goal: Define state of the art on life cycle stages to be considered. => Goal: Define state of the art on life cycle stages to be considered.
  
-### Database and tools + 
-#### What are the already existing data (dataset, parametric model, paper, etc.)?+==== Database and tools ==== 
 + 
 +===  Already existing data === 
 TBC TBC
  
-### Raw materials+==== Raw materials ==== 
 => Goal: List the technical information needed for the LCI. => Goal: List the technical information needed for the LCI.
  
-#### What is it made of?+[comment]: <> ( 
 +===  What is it made of? === 
 TBC TBC
-#### Who are the main mining? Where are they located?+===  Who are the main mining? Where are they located? === 
 TBC TBC
-#### Is there mining processes information available?+=== Is there mining processes information available? === 
 TBC TBC
-### Manufacturing +)
-=> Goal: List the technical information needed for the LCI.+
  
 +\\
 +====  Manufacturing ====
 +
 +=> Goal: List the technical information needed for the LCI.
 +[comment]: <> (
 //For each system sub-part:// //For each system sub-part://
-#### What are the manufacturing processes?+===  What are the manufacturing processes? === 
 TBC TBC
-#### What are the assembly processes?+===   What are the assembly processes? === 
 +  
 TBC TBC
-#### For each process, what is the energy consumption?+===  For each process, what is the energy consumption? === 
 TBC TBC
-#### For each process, what are the inputs (water, chemicals, etc.) ?+===  For each process, what are the inputs : water, chemicals, etc. ? === 
 TBC TBC
-#### For each process, what is the yield? Are they co-products and/or losses?+===  For each process, what is the yield? Are they co-products and/or losses? === 
 TBC TBC
  
-#### How the “main” manufacturers can be characterized: by the number of components manufactured, the market share (€), other?+=== How the “main” manufacturers can be characterized: by the number of components manufactured, the market share in €, other? === 
  
 Source of market information : https://www.fortunebusinessinsights.com/optical-sensors-market-102097 Source of market information : https://www.fortunebusinessinsights.com/optical-sensors-market-102097
 +)
  
-#### Who are the main manufacturers? Where are they located?+===  Main manufacturers ===
  
 * Sony corporation (Japan, Integrated Device Manufacturer (IDM)) * Sony corporation (Japan, Integrated Device Manufacturer (IDM))
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 +\\
 +
 +====  Distribution and packaging ====
  
-### Distribution and packaging 
 => Goal: List the technical information needed for the LCI. => Goal: List the technical information needed for the LCI.
  
-#### What are the packaging? Made of which materials? +[comment]: <> ( 
-TBC +=== What are the packaging? Made of which materials? ===
-#### Which are the transport modes? +
-TBC +
-#### What are the transport distances? +
-TBC+
  
-### Use 
-=> Goal: List the technical information needed for the LCI. 
- 
-#### What is the service lifespan? (durée d'utilisation) 
-TBC 
-#### Is there a reparation factor? 
-TBC 
-#### Is there sub-parts replacement? 
 TBC TBC
 +===  Which are the transport modes? ===
  
-#### Where is it used? 
 TBC TBC
-#### Who are the users? +===  What are the transport distances? ===
-TBC +
-#### Which + how much energy does it need? +
-TBC +
-#### Is there emissions from use? +
-TBC +
-### End of life +
-=> Goal: List the technical information needed for the LCI.+
  
-#### What is the lifetime? (durée de vie) 
-TBC 
-#### Is it different from lifespan and why? 
-TBC 
-#### Is it refurbished? + Where? 
-TBC 
-#### Is it recyclable? Can it be dismantled? Which material can be separated? + Where and how? 
-TBC 
-#### Is it incinerated with energy recovery? Just incinerated? Buried? + Where? 
-TBC 
-#### Which part of waste can be considered as mismanaged (neither recycled, nor incinerated, nor buried)? 
 TBC TBC
 +)
  
-======  State of the art: environmental impacts ======+==== Use ====
  
-===== Streamlined Models of CMOS Image Sensors Carbon Impacts ===== +Not in the scope
- [([[https://ieeexplore.ieee.org/abstract/document/10741688|O. Weppe, J. Chossat, T. Marty, J. -C. Prévotet and M. Pelcat, "Streamlined Models of CMOS Image Sensors Carbon Impacts," 2024 27th Euromicro Conference on Digital System Design (DSD), Paris, France, 2024, pp. 250-257, doi: 10.1109/DSD64264.2024.00041]])] +
-=== Methodology === +
-Streamlined GHG emission model based on a linear relationship between silicon die surface area and Global Warming Potential (GWP), expressed in gCO<sub>2</sub>eq. The model follows: +
-$$G_{Fab} = \sum_{i=1}^{N} S_i \cdot (E_i \cdot T_{loc} +K_i)$$ +
-G<sub>Fab</sub> : Global Warming Potential (GWP) of the fabrication ( gCO<sub>2</sub> eq)\\ +
-S<sub>i</sub> : the surface of layer i \\ +
-E<sub>i</sub> : electrical energy consumption of layer i \\ +
-T<sub>loc</sub> : electrical carbon intensity of the location of fabrication\\ +
-K<sub>i</sub> : ancillary impact of the layer (infrastructure, factory, chemicals and raw materials)+
  
-The value of K<sub>i</sub> and E<sub>i</sub> are taken from [([[http://link.springer.com/10.1007/978-1-4419-9988-7|S. B. Boyd, Life-Cycle Assessment of Semiconductors. New York, NY: Springer, 2012.]])] +====  End of life ====
-=== Types of Technologies Covered (System Definition) === +
-CMOS Image Sensor (CIS). Parameters affecting the scope: +
-* CCD / CMOS +
-* Mono / color sensor +
-* Resolution → sensor size +
-* Pixel size → sensor size +
-* Stacking +
-=== Life Cycle Stages Covered === +
-* Silicon die fabrication +
-* Electricity consumption over lifespan +
-=== Fluxes Included in the Scope === +
-Generic semiconductor data for a CIS. The following are excluded: +
-* Lens +
-* Color filter array +
-* Other optical components +
-=== Main Results === +
-Known hotspots : silicon die manufacturing, electricity consumption over lifespan, 2D/3D die stacking (factor 2 difference) +
-{{ ::comparasaion_gwp_proposed_models.png?direct&400 |https://ieeexplore.ieee.org/abstract/document/10741688}} +
-=== Limitations === +
-Uses generic semiconductor data for a CIS, and therefore does not account for the specificities of CMOS image sensors, such as the lens, the color filter array, or other optical components.+
  
-## Bibliography +Not in the scope
-=> Goal: Source every data we cited previously+
  
-### List of our sources +\\
-TBC +
-### Data origin: bibliographic source / consortium hypothesis / expert opinion - required if a Data Quality Rating (DQR) must be completed +
-TBC+
  
 +=====  Next steps =====
  
-## Next steps 
 => Goal: List challenges and clarify priority areas for action => Goal: List challenges and clarify priority areas for action
  
-### What do we know we don't know?+[comment]: <> ( 
 +==== What do we know we don't know? ==== 
 TBC TBC
-### What are the identified challenges?+====  What are the identified challenges? ==== 
 TBC TBC
-### What paths/ideas should be explored?+====  What paths/ideas should be explored? ==== 
 TBC TBC
 +)
 +
 +\\
 +=====  Bibliography =====
 +~~REFNOTES~~