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intro_optical_sensor [2026/06/09 12:09] – antoineintro_optical_sensor [2026/08/05 15:16] (current) – antoine
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 An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods. An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods.
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 The global optical sensor market was worth around \$25–28 billion in 2025 and is expected to reach approximately \$71.7 billion by 2035 [(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])]. This increase is directly linked to progress in automation, imaging and environmental monitoring technologies, as well as to the needs of the automotive, medical and industrial sectors.  The global optical sensor market was worth around \$25–28 billion in 2025 and is expected to reach approximately \$71.7 billion by 2035 [(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])]. This increase is directly linked to progress in automation, imaging and environmental monitoring technologies, as well as to the needs of the automotive, medical and industrial sectors. 
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 The main parts of a [[intro_cmos|CMOS]] image sensor are the following: The main parts of a [[intro_cmos|CMOS]] image sensor are the following:
  
-* Sensor chip (wafer, node = 40-180nm): An array of photosensitive pixels, with Bayer pattern +* Microlens : Focus the light and direct it to the photodiode 
-* Wire bonds +* Color filter : Designate light colors 
-* Package +* Photodiode : Absorbs the light and converts it into an electrical charge 
-* Cover glass +* Transisors : Control the signal flow and processing 
-* Contact pads+* Package : Protect the chip and provide connections to the electronics that will use the image. 
  
 <figure center |CMOS> <figure center |CMOS>
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-Focus on the CMOS optical sensor.+This study will focus on the CMOS optical sensor.
  
  
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-Exclusion of other sensors like the distance sensor to adjust the focus. +Exclusion of other sensors such as Photoelectric sensors, Active ranging sensor modules, Infrared sensors, etc.
-Exclusion of the rest of the image-processing system (PCB, controllers, etc.).+
  
-Exclusion of laser sensor and IR sensors. Not the focus for now+Exclusion of the component for the image-processing system (PCB, controllers, etc.).
  
 ==== Functional unit and reference flows ==== ==== Functional unit and reference flows ====
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 === Main Results === === Main Results ===
 Known hotspots : silicon die manufacturing, electricity consumption over lifespan, 2D/3D die stacking (factor 2 difference) Known hotspots : silicon die manufacturing, electricity consumption over lifespan, 2D/3D die stacking (factor 2 difference)
-{{ ::comparasaion_gwp_proposed_models.png?direct&400 |https://ieeexplore.ieee.org/abstract/document/10741688}}+ 
 +<figure center |comparaison> 
 +{{ ::comparasaion_gwp_proposed_models.png?direct&600 |https://ieeexplore.ieee.org/abstract/document/10741688}} 
 +<caption> Comparaison proposed models </caption> 
 +</figure>
  
 \\ \\
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-=====  Life Cycle - Inventory =====+=====  Life Cycle - Inventory (⚠️WORK IN PROGRESS⚠️)=====
    
  
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 ====  Manufacturing ==== ====  Manufacturing ====
  
 +[[CMOS_manufacturing|CMOS manufacturing]]
 => Goal: List the technical information needed for the LCI. => Goal: List the technical information needed for the LCI.
 [comment]: <> ( [comment]: <> (