intro_pcb
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| intro_pcb [2025/11/24 10:08] – [Are they different types and technologies?] louise | intro_pcb [2026/01/14 09:12] (current) – louise | ||
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| # PCB | # PCB | ||
| - | + | ## System definition - Goal and scope | |
| - | ## Introduction | + | |
| ### Definition | ### Definition | ||
| + | |||
| + | #### What is it used for? | ||
| * PCB = Printed Circuit Board | * PCB = Printed Circuit Board | ||
| * Other name: printed wiring board (PWB) | * Other name: printed wiring board (PWB) | ||
| + | * It is used to connect components to one another in an electronic circuit. | ||
| - | ### What is it used for? | + | #### Are there different types/ |
| - | * It is used to connect components to one another in an electronic circuit. | + | They are various types of PCBs. |
| - | ### Are they different types and technologies? | + | |
| + | They can differ in terms of technology: | ||
| + | | ||
| + | * **Surface-Mount Technology** (SMT), used in most digital equipment | ||
| + | |||
| + | They can have different structures: | ||
| + | * Rigid | ||
| + | * Rigid-flex | ||
| + | * Flex | ||
| + | |||
| + | They can be very different depending on their specialization too: | ||
| + | * High temperature | ||
| + | * Heavy copper | ||
| + | * High frequency | ||
| + | * Metal core | ||
| + | * High density | ||
| + | * Substrate-like | ||
| + | |||
| + | #### If different types, what are the differences in terms of materials, process, use consumption? | ||
| + | |||
| + | #### Is there a generic component that represents a family of components? | ||
| + | |||
| + | #### How many sub-parts does the system consist of? | ||
| + | |||
| + | |||
| + | ### Perimeter | ||
| + | |||
| + | #### What is included? | ||
| + | |||
| + | * Naked PCB | ||
| + | * Rigid | ||
| + | * Double-sided or multilayer | ||
| + | |||
| + | #### What is excluded? | ||
| + | |||
| + | * ICs on top of the PCB, without any electronic components on it | ||
| + | * R&D activities to develop the PCB | ||
| + | |||
| + | ### Functional unit and reference flows | ||
| + | |||
| + | #### What is the functional unit? | ||
| + | #### What are the reference flows? | ||
| + | |||
| + | |||
| + | |||
| + | ## Life cycle - Inventory | ||
| + | |||
| + | => Goal: Define state of the art on life cycle stages to be considered. | ||
| + | |||
| + | ### Database and tools | ||
| - | TBC | + | #### What are the already existing data (dataset, parametric model, paper, etc.)? |
| - | ## Manufacturing and processes | + | ### Raw materials |
| + | => Goal: List the technical information needed for the LCI. | ||
| - | ### What is it made of? | + | #### What is it made of? |
| - | * Raw materials | + | |
| * FR-4 = glass-reinforced epoxy laminate material (epoxy resin + glass fiber) | * FR-4 = glass-reinforced epoxy laminate material (epoxy resin + glass fiber) | ||
| * copper | * copper | ||
| - | * Chemicals | + | |
| * potassium carbonate | * potassium carbonate | ||
| * dicyanoaurate | * dicyanoaurate | ||
| * sodium hydroxide | * sodium hydroxide | ||
| - | ### How is it manufactured? | + | |
| + | #### Who are the main mining? Where are they located? | ||
| + | #### Is there mining processes information available? | ||
| + | |||
| + | |||
| + | ### Manufacturing | ||
| + | |||
| + | => Goal: List the technical information needed for the LCI. | ||
| + | |||
| + | For each system sub-part: | ||
| + | |||
| + | #### What are the manufacturing processes? | ||
| * laminating | * laminating | ||
| Line 35: | Line 98: | ||
| * plating | * plating | ||
| - | ### Who are the main manufacturers? | + | #### What are the assembly processes? |
| + | #### For each process, what is the energy consumption? | ||
| + | #### For each process, what are the inputs (water, chemicals, etc.) ? | ||
| + | #### For each process, what is the yield? Are they co-products and/or losses? | ||
| - | TBC | + | #### How the “main” manufacturers can be characterized: |
| + | #### Who are the main manufacturers? | ||
| - | ### Where are they located? | ||
| - | TBC | + | ### Distribution and packaging |
| + | => Goal: List the technical information needed for the LCI. | ||
| + | |||
| + | #### What are the packaging? Made of which materials? | ||
| + | #### Which are the transport modes? | ||
| + | #### What are the transport distances? | ||
| + | |||
| + | ### Use | ||
| + | |||
| + | => Goal: List the technical information needed for the LCI. | ||
| + | |||
| + | #### What is the service lifespan? (durée d' | ||
| + | #### Is there a reparation factor? | ||
| + | #### Is there sub-parts replacement? | ||
| + | |||
| + | #### Where is it used? | ||
| + | #### Who are the users? | ||
| + | #### Which + how much energy does it need? | ||
| + | #### Is there emissions from use? | ||
| + | |||
| + | |||
| + | ### End of life | ||
| + | |||
| + | => Goal: List the technical information needed for the LCI. | ||
| + | |||
| + | #### What is the lifetime? (durée de vie) | ||
| + | #### Is it different from lifespan and why? | ||
| + | #### Is it refurbished? | ||
| + | #### Is it recyclable? Can it be dismantled? Which material can be separated? + Where and how? | ||
| + | #### Is it incinerated with energy recovery? Just incinerated? | ||
| + | #### Which part of waste can be considered as mismanaged (neither recycled, nor incinerated, | ||
| ## Environmental footprint | ## Environmental footprint | ||
| - | ### What are the main environmental impacts | + | => Goal: Define state of the art on environmental impacts. |
| - | TBC | + | #### What are the impact assessment methods used (EF, ReCiPe, others)? |
| - | ### What are the main environmental impacts associated to the manufacturing processes? | + | #### What are the known environmental impacts associated to the system (indicators)? |
| + | #### What are the known hotspots? Which raw material? Which life stage? | ||
| * Processes | * Processes | ||
| Line 65: | Line 162: | ||
| * water usage | * water usage | ||
| - | ### What are the potential parameters affecting environmental | + | |
| + | #### What are the potential parameters affecting environmental | ||
| Impactful parameters : | Impactful parameters : | ||
| - | * Number of layers (1 to 16) | + | * Technology: Through-Hole Technology (THT) or Surface Mount Technology (SMT) |
| - | * Surface | + | * Substrate material: FR4 (mostly used), bio-based material, etc. |
| + | * Number of layers (1 to 16 generally) | ||
| + | * Surface | ||
| * Type of surface finish | * Type of surface finish | ||
| + | #### What are the main source of uncertainty? | ||
| + | |||
| + | |||
| + | |||
| + | ## Bibliography | ||
| + | => Goal: Source every data we cited previously | ||
| + | |||
| + | #### List of our sources | ||
| + | #### Data origin: bibliographic source / consortium hypothesis / expert opinion - required if a Data Quality Rating (DQR) must be completed | ||
| + | |||
| + | |||
| + | |||
| + | ## Next steps | ||
| + | => Goal: List challenges and clarify priority areas for action | ||
| + | |||
| + | #### What do we know we don't know? | ||
| + | #### What are the identified challenges? | ||
| + | #### What paths/ideas should be explored? | ||
intro_pcb.1763975300.txt.gz · Last modified: by louise