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intro_pcb

PCB

System definition - Goal and scope

Definition

What is it used for?

  • PCB = Printed Circuit Board
  • Other name: printed wiring board (PWB)
  • It is used to connect components to one another in an electronic circuit.

Are there different types/technologies?

They are various types of PCBs.

They can differ in terms of technology:

  • Through-Hole Technology (THT), old technology. Still used for power electronics.
  • Surface-Mount Technology (SMT), used in most digital equipment

They can have different structures:

  • Rigid
  • Rigid-flex
  • Flex

They can be very different depending on their specialization too:

  • High temperature
  • Heavy copper
  • High frequency
  • Metal core
  • High density
  • Substrate-like

If different types, what are the differences in terms of materials, process, use consumption?

Is there a generic component that represents a family of components?

How many sub-parts does the system consist of?

Perimeter

What is included?

  • Naked PCB
    • Rigid
    • Double-sided or multilayer

What is excluded?

  • ICs on top of the PCB, without any electronic components on it
  • R&D activities to develop the PCB

Functional unit and reference flows

What is the functional unit?

What are the reference flows?

Life cycle - Inventory

⇒ Goal: Define state of the art on life cycle stages to be considered.

Database and tools

What are the already existing data (dataset, parametric model, paper, etc.)?

Raw materials

⇒ Goal: List the technical information needed for the LCI.

What is it made of?

  • Raw materials
    • FR-4 = glass-reinforced epoxy laminate material (epoxy resin + glass fiber)
    • copper
  • Chemicals
    • potassium carbonate
    • dicyanoaurate
    • sodium hydroxide

Who are the main mining? Where are they located?

Is there mining processes information available?

Manufacturing

⇒ Goal: List the technical information needed for the LCI.

For each system sub-part:

What are the manufacturing processes?

  • laminating
  • drilling
  • etching
  • plating

What are the assembly processes?

For each process, what is the energy consumption?

For each process, what are the inputs (water, chemicals, etc.) ?

For each process, what is the yield? Are they co-products and/or losses?

How the “main” manufacturers can be characterized: by the number of components manufactured, the market share (€), other?

Who are the main manufacturers? Where are they located?

Distribution and packaging

⇒ Goal: List the technical information needed for the LCI.

What are the packaging? Made of which materials?

Which are the transport modes?

What are the transport distances?

Use

⇒ Goal: List the technical information needed for the LCI.

What is the service lifespan? (durée d'utilisation)

Is there a reparation factor?

Is there sub-parts replacement?

Where is it used?

Who are the users?

Which + how much energy does it need?

Is there emissions from use?

End of life

⇒ Goal: List the technical information needed for the LCI.

What is the lifetime? (durée de vie)

Is it different from lifespan and why?

Is it refurbished? + Where?

Is it recyclable? Can it be dismantled? Which material can be separated? + Where and how?

Is it incinerated with energy recovery? Just incinerated? Buried? + Where?

Which part of waste can be considered as mismanaged (neither recycled, nor incinerated, nor buried)?

Environmental footprint

⇒ Goal: Define state of the art on environmental impacts.

What are the impact assessment methods used (EF, ReCiPe, others)?

What are the known environmental impacts associated to the system (indicators)?

What are the known hotspots? Which raw material? Which life stage?

  • Processes
    • PCB factory
  • Energy use
    • Electricity

Data needed from manufacturer :

  • production volume
  • line capacity
  • installed power
  • water usage

What are the potential parameters affecting environmental impacts?

Impactful parameters :

  • Technology: Through-Hole Technology (THT) or Surface Mount Technology (SMT)
  • Substrate material: FR4 (mostly used), bio-based material, etc.
  • Number of layers (1 to 16 generally)
  • Surface (m2) → yield
  • Type of surface finish

What are the main source of uncertainty?

Bibliography

⇒ Goal: Source every data we cited previously

List of our sources

Data origin: bibliographic source / consortium hypothesis / expert opinion - required if a Data Quality Rating (DQR) must be completed

Next steps

⇒ Goal: List challenges and clarify priority areas for action

What do we know we don't know?

What are the identified challenges?

What paths/ideas should be explored?

intro_pcb.txt · Last modified: by louise