Differences

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--- intro_pcb [2026/04/13 09:37] – [Definition] marie
+++ intro_pcb [2026/04/17 10:33] (current) – [Definition] marie
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 The number of layers refers to the number of repetition of conductive traces layers. The layers are interconnected one to another via copper traces. The more layer with similar density will enable more possibility of interconnections between components. It induces 3 categories of PCBs, each having its own impact on the manufacturing process and field of application:
-  * Single-sided PCB: only one side of the board contains a conductive trace. Thus, the manufacturing process is the shortest as it requires only on traces printing and plating and does not require any alignment with other layer traces. As there is only one trace, it cannot interconnect many component and is thus used for very simple application like toys or basic calculators.
+  * **Single-sided PCB**: only one side of the board contains a conductive trace. Thus, the manufacturing process is the shortest as it requires only on traces printing and plating and does not require any alignment with other layer traces. As there is only one trace, it cannot interconnect many component and is thus used for very simple application like toys or basic calculators.
-  * Double-sided PCB: the two sides of the board contain a conductive trace.  Thus, alignment of drills needs to be performed as well as trhough-hole plating to ensure inteconnections between the two sides of the PCB. This type of PCB is more common for power supplies, HVAC controllers or more complex IoT devices.
+  * **Double-sided PCB**: the two sides of the board contain a conductive trace.  Thus, alignment of drills needs to be performed as well as trhough-hole plating to ensure inteconnections between the two sides of the PCB. This type of PCB is more common for power supplies, HVAC controllers or more complex IoT devices.
-  * Multilayer PCB: The board contains several layers of conductive traces above 2. It implies to superimpose serveral layers of insulating layers.The manufacturing is more complex. It requires the repetition of pattern printing and plating on each inner layer, which are then laminated together, before following the same manufacturing steps as in lower-layer count PCBs. The number of layer requires a high accuracy alignement of layer before driling to ensure inter-layer interconnections. This type of PCBs can account for diverse level of complexity, and are the one used in most electronic devices, like computers, medical equipment, TVs, etc.
+  * **Multilayer PCB**: The board contains several layers of conductive traces above 2. It implies to superimpose serveral layers of insulating layers.The manufacturing is more complex. It requires the repetition of pattern printing and plating on each inner layer, which are then laminated together, before following the same manufacturing steps as in lower-layer count PCBs. The number of layer requires a high accuracy alignement of layer before driling to ensure inter-layer interconnections. This type of PCBs can account for diverse level of complexity, and are the one used in most electronic devices, like computers, medical equipment, TVs, etc.
 The more layer, the more substrate, insulating material and copper traces.
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 The structure of the PCBs aims at distinguishing the requirements in terms of shape of the of PCBs depending in which product it is aimed to be integrated.
-  * Rigid: A rigid structure is the most classical shape of a PCB. It is composed of rigid and robustmaterial, usualy FR-4 material. It is compatible with both assembly technology. It is the most common structure and present in components like computers, medical equipements.
+  * **Rigid**: A rigid structure is the most classical shape of a PCB. It is composed of rigid and robustmaterial, usualy FR-4 material. It is compatible with both assembly technology. It is the most common structure and present in components like computers, medical equipements.
-  * Flex: It is composed of flexible plastic film like polyimide or PET. It adapts to many equipment shapes, it is light and resistant to vibration. It is particularly present in wearables.
+  * **Flex**: It is composed of flexible plastic film like polyimide or PET. It adapts to many equipment shapes, it is light and resistant to vibration. It is particularly present in wearables.
-  * Rigid-flex: The structure is a mix between rigid PCBs boads and flexible interconnection between them. It combines the advantages of rigid PCBs while adapting to compact components. It requires complex lamination step to combine both PCB structures.
+  * **Rigid-flex**: The structure is a mix between rigid PCBs boads and flexible interconnection between them. It combines the advantages of rigid PCBs while adapting to compact components. It requires complex lamination step to combine both PCB structures.
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 The specialization of the PCBs refers to categories of PCBs with a specific need, thus requiring specific properties.
-  * High temperature: It is the type of PCB required when the component is exposed to very high temperatures or is assembled with high temperature technologies. The substrate is made of specific high glass transition temperature that remain stable under high temperature.
+  * **High temperature**: It is the type of PCB required when the component is exposed to very high temperatures or is assembled with high temperature technologies. The substrate is made of specific high glass transition temperature that remain stable under high temperature.
-  * Heavy copper: this PCBs contains contains a high thickness of copper. It is used for application where current is high to avoid voltage drops, overheating and limit current loss. It is selected for power converters, power distribution or battery management systems.
+  * **Heavy copper**: this PCBs contains contains a high thickness of copper. It is used for application where current is high to avoid voltage drops, overheating and limit current loss. It is selected for power converters, power distribution or battery management systems.
-  * High frequency: it is used for application where a high frequency of interconnection is required and thus must ensure signal integrity and minimize signal loss and distortion. The substrates are made of hydrocarbon ceramics or modified epoxies in this case. It is used for high-frequency systems like 5G/6G antennas, radar systems or communication system of satellites.
+  * **High frequency**: it is used for application where a high frequency of interconnection is required and thus must ensure signal integrity and minimize signal loss and distortion. The substrates are made of hydrocarbon ceramics or modified epoxies in this case. It is used for high-frequency systems like 5G/6G antennas, radar systems or communication system of satellites.
-  * Metal core : This kind of PCB contains a metal core, in addition to copper traces. The metal core, often made of aluminium, helps to dissipate heat for component with high power like LEDs or power transistors.
+  * **Metal core**: This kind of PCB contains a metal core, in addition to copper traces. The metal core, often made of aluminium, helps to dissipate heat for component with high power like LEDs or power transistors.
-  * High density: The high-density PCBs aim at concentrate a high density of interconnections between several components. It is possible via burried vias and micro-vias, in addition to through-hole vias. The drills are performed using laser drillers. It is mainly used for compact devices, smarthones and high-end equipment (servers...).
+  * **High Density Interconnect (HDI)**: The high-density interconnect PCBs aim at concentrate a high density of interconnections between several components. It is possible via burried vias and micro-vias, in addition to through-hole vias. The drills are performed using laser drillers. It is mainly used for compact devices, smarthones and high-end equipment (servers...).
-  * Substrate-like: This kind of PCBs embeds even more dense interconnections with very thin traces than HDI PCBs. Its manufacturing process is highly inspired from IC industry. It requires semi-additive process for plating steps and UV laser direct imaging technology to maintain very thin interconnections. This is particularly useful for high-perfomance components with a high compactivity like high-end smartphones.
+  * **Substrate-like PCB**: This kind of PCBs embeds even more dense interconnections with very thin traces than HDI PCBs. Its manufacturing process is highly inspired from IC industry. It requires semi-additive process for plating steps and UV laser direct imaging technology to maintain very thin interconnections. This is particularly useful for high-perfomance components with a high compactivity like high-end smartphones.
-  * Classical PCB: The standard PCB structure made of FR4 substrate.
+  * **Standard PCB**: The standard PCB structure made of FR4 substrate.
 __Source:__
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 **Assembly technologies**
-Once the bare PCB is manufactured, elements to be interconnected needs to be assembled on top of it. Among the elements that populates PCBs, we can find CPU sockers, RAM slots, but also capacitors, resitances...
+Once the bare PCB is manufactured, elements to be interconnected needs to be assembled on top of it. Among the elements that populates PCBs, we can find CPU sockets, RAM slots, but also capacitors, resitances...
 The PCB can be populated according to two technologies:
   * **Through-Hole Technology** (THT). It consists in having leads passing through previously drilled holes, that are soldered on pads present on the opposite side of the PCB. This is an old technology, but still used for some power electronics.
-  * **Surface-Mount Technology** (SMT). The components are directly soldered on pads, without requiring through holes. It is the technology used for most digital equipment
+  * **Surface-Mount Technology** (SMT). The components are directly soldered on pads, without requiring through holes. It is the technology used for most digital equipment.
-The assembly technology do not influence the manufacturing process of bare PCB.
+The assembly technology do not influence drastically the manufacturing process of bare PCB. It can sometimes influence the choice of substrate when it implies high temperatures.
+__Source:__ https://asselems.com/en/what-is-the-assembly-of-a-pcb
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 #### How many sub-parts does the system consist of?
-The system is composed of one main part, the board itself, composed itself of a succession of layers of substrate, insulating material and copper traces. When the PCB has a rigid-flex structure, we can consider that it is composed of a set of rigid PCB board, connected via a set of flexible PCB board.
+The system is composed of one main part, the board itself, composed itself of a succession of layers of substrate, insulating material and copper traces. When the PCB has a rigid-flex structure, we can consider that it is composed of a set of rigid PCB board, connected via a set of flexible PCB board
+.
 ### Perimeter
 #### What is included?
-* Bare PCB
+This study aims at providing the cradle-to-gate environmental impact:
-  * Rigid
+  * Rigid bare PCBs.
-  * Double-sided or multilayer
+  * Standard PCB specialization.
+  * With either 2 or multiple layers.
 #### What is excluded?
-* ICs on top of the PCB, without any electronic components on it
+This study exludes:
-* R&D activities to develop the PCB
+  * All electronics devices assembled on the bare PCB.
-* Input copper clad laminate process
+  * R&D activities to develop the PCB.
+  * The transition of the boards between manufacturing stages, which can be either manual or automated.
+  * The input copper clad laminate process impact.
+  * The end-of-production line multiple tests.
 ### Functional unit and reference flows
 #### What is the functional unit?
+The functional unit of this study is **"manufacture one squared-meter of rigid standard bare PCB"**.
 #### What are the reference flows?
+The reference flows are:
+  * The surface of substrate
+  * The surface of copper foil
+  * The weight of platted metal, both copper and surface finish ones