intro_pcb
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| intro_pcb [2026/04/13 10:30] – [Perimeter] marie | intro_pcb [2026/04/17 10:33] (current) – [Definition] marie | ||
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| #### How many sub-parts does the system consist of? | #### How many sub-parts does the system consist of? | ||
| - | The system is composed of one main part, the board itself, composed itself of a succession of layers of substrate, insulating material and copper traces. When the PCB has a rigid-flex structure, we can consider that it is composed of a set of rigid PCB board, connected via a set of flexible PCB board. | + | The system is composed of one main part, the board itself, composed itself of a succession of layers of substrate, insulating material and copper traces. When the PCB has a rigid-flex structure, we can consider that it is composed of a set of rigid PCB board, connected via a set of flexible PCB board |
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| + | . | ||
| ### Perimeter | ### Perimeter | ||
| #### What is included? | #### What is included? | ||
| - | This study aims at providing the cradle-to-gate environmental impact | + | This study aims at providing the cradle-to-gate environmental impact: |
| + | * Rigid bare PCBs. | ||
| + | * Standard PCB specialization. | ||
| + | * With either 2 or multiple layers. | ||
| #### What is excluded? | #### What is excluded? | ||
| This study exludes: | This study exludes: | ||
| - | * All electronics devices assembled on the bare PCB, | + | |
| - | * R&D activities to develop the PCB | + | * R&D activities to develop the PCB. |
| - | * The transition of the boards between manufacturing stages, which can be either manual or automated. | + | * The transition of the boards between manufacturing stages, which can be either manual or automated. |
| - | * The input copper clad laminate process impact | + | * The input copper clad laminate process impact. |
| - | * The end-of-production line multiple tests. | + | * The end-of-production line multiple tests. |
| ### Functional unit and reference flows | ### Functional unit and reference flows | ||
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| #### What is the functional unit? | #### What is the functional unit? | ||
| - | 1m² of produced | + | The functional unit of this study is **" |
| #### What are the reference flows? | #### What are the reference flows? | ||
| + | |||
| + | The reference flows are: | ||
| + | * The surface of substrate | ||
| + | * The surface of copper foil | ||
| + | * The weight of platted metal, both copper and surface finish ones | ||
intro_pcb.1776069025.txt.gz · Last modified: by marie