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intro_pcb [2026/07/02 14:39] – [Life cycle Inventory] sophieintro_pcb [2026/07/07 15:56] (current) – [State of the art: environmental impacts] lucas.burlot.ext
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 | **Scope** | Cradle-to-grave | Cradle-to-waste | Board fab + manufacturing | Gate-to-gate / Cradle-to-gate | Cradle-to-gate | | **Scope** | Cradle-to-grave | Cradle-to-waste | Board fab + manufacturing | Gate-to-gate / Cradle-to-gate | Cradle-to-gate |
 | **Use phase** | Excluded | Excluded | Excluded | Excluded | Excluded | | **Use phase** | Excluded | Excluded | Excluded | Excluded | Excluded |
-| **Technology** | FR-4, PET, paper, multilayer | FR-4 vs paper P-PCB | FR-4 single-layer | FR-4 PTH, all stackups | FR-4, 6Layers SMT | +| **Technology** | FR-4, PET, paper, multilayer | FR-4 single-layer | FR-4 vs paper P-PCB | FR-4 PTH, all stackups | FR-4, 6Layers SMT | 
-| **Key GWP hotspot** | Epoxy resin, layer count | Copper (O-PCB); silver (P-PCB) | Etching (FAETP, ODP); copper in board fab | Electricity consumption (~86% of GHG) | Electricity (~45% GWP) | +| **Key GWP hotspot** | Epoxy resin, layer count | Etching (FAETP, ODP); copper in board fab | Copper (O-PCB); silver (P-PCB) | Electricity consumption (~86% of GHG) | Electricity (~45% GWP) | 
-| **GWP order of magnitude** | ~3–11 kg CO₂eq/25 cm² | 39.2 kg CO₂e/m² (O-PCB) | 18.6 kg CO₂e/m² | 60–200 kg CO₂e/m² (company range) | 200 kg CO2eq/m² |+| **GWP order of magnitude** | ~50–500 kg CO₂eq/m² | 18.6 kg CO₂e/m² | 39.2 kg CO₂e/m² (O-PCB) | 60–200 kg CO₂eq/m² (company range) | 200 kg CO2eq/m² |
  
   * **Liu et al. (2014)** — //Future Paper-Based Printed Circuit Boards for Green Electronics: Fabrication and LCA[(liu>[[https://pubs.rsc.org/en/content/articlelanding/2014/ee/c4ee01995d | Liu, Jingping & Yang, Cheng & Wu, Haoyi & Lin, Ziyin & Zhang, Zhexu & Wang, Ronghe & Li, Baohua & Kang, Feiyu & Shi, Lei & Wong, C.P.. Future Paper based Printed Circuit Boards for Green Electronics: Fabrication and Life Cycle Assessment. Energy Environ. Sci.. 7 (2014). https://doi.org/10.1039/C4EE01995D. ]])]//   * **Liu et al. (2014)** — //Future Paper-Based Printed Circuit Boards for Green Electronics: Fabrication and LCA[(liu>[[https://pubs.rsc.org/en/content/articlelanding/2014/ee/c4ee01995d | Liu, Jingping & Yang, Cheng & Wu, Haoyi & Lin, Ziyin & Zhang, Zhexu & Wang, Ronghe & Li, Baohua & Kang, Feiyu & Shi, Lei & Wong, C.P.. Future Paper based Printed Circuit Boards for Green Electronics: Fabrication and Life Cycle Assessment. Energy Environ. Sci.. 7 (2014). https://doi.org/10.1039/C4EE01995D. ]])]//
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 Temporal and technological representativeness: //Primary data sourced from AT&S AG (2006), US EPA (1995/2000), and ZVEI (2006). Given the pace of process optimisation in PCB manufacturing — particularly energy efficiency and chemical management — this nearly 20-year-old data is likely to overestimate current consumption intensities. This is explicitly flagged as a concern//. Temporal and technological representativeness: //Primary data sourced from AT&S AG (2006), US EPA (1995/2000), and ZVEI (2006). Given the pace of process optimisation in PCB manufacturing — particularly energy efficiency and chemical management — this nearly 20-year-old data is likely to overestimate current consumption intensities. This is explicitly flagged as a concern//.
 Electricity mix: The dataset uses the Global electricity mix. Users can adapt the electricity mix by copying and editing the dataset in SimaPro or similar tools, but this requires awareness and additional effort. Electricity mix: The dataset uses the Global electricity mix. Users can adapt the electricity mix by copying and editing the dataset in SimaPro or similar tools, but this requires awareness and additional effort.
-Gold and surface finish: As the amount of gold in the PCB is a key contributor to environmental impact, there is a need for precise gold quantity in PCB for an accurate LCA. Also, for PCBs without a gold finish there is an important “hidden burden” by using this dataset, though it is possible to copy the dataset and subtract the gold if needed. +Gold and surface finish: As the amount of gold in the PCB is a key contributor to environmental impact, there is a need for precise gold quantity in PCB for an accurate LCA. Also, for PCBs without a gold finish there is an important “hidden burden” by using this dataset, though it is possible to copy the dataset and subtract the gold if needed 
 +.
 ###Other information on impact assesment : ###Other information on impact assesment :
  
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  By proposing a parametric LCA, like choosing between finish types and electricity mixes, we should allow easier and better assesment of the PCB.  By proposing a parametric LCA, like choosing between finish types and electricity mixes, we should allow easier and better assesment of the PCB.
 +
 ## Life cycle Inventory (⚠️WORK IN PROGRESS⚠️) ## Life cycle Inventory (⚠️WORK IN PROGRESS⚠️)
 [comment]: <> (=> Goal: Define state of the art on life cycle stages to be considered.) [comment]: <> (=> Goal: Define state of the art on life cycle stages to be considered.)
 [comment]: <> (### Database and tools) [comment]: <> (### Database and tools)
 [comment]: <> (#### What are the already existing data (dataset, parametric model, paper, etc.) [comment]: <> (#### What are the already existing data (dataset, parametric model, paper, etc.)
-)+
 ### Raw materials ### Raw materials
 [comment]: <> (=> Goal: List the technical information needed for the LCI.) [comment]: <> (=> Goal: List the technical information needed for the LCI.)