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| intro_pcb [2026/07/07 14:05] – [State of the art: environmental impacts] lucas.burlot.ext | intro_pcb [2026/07/07 15:56] (current) – [State of the art: environmental impacts] lucas.burlot.ext | ||
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| | **Scope** | Cradle-to-grave | Cradle-to-waste | Board fab + manufacturing | Gate-to-gate / Cradle-to-gate | Cradle-to-gate | | | **Scope** | Cradle-to-grave | Cradle-to-waste | Board fab + manufacturing | Gate-to-gate / Cradle-to-gate | Cradle-to-gate | | ||
| | **Use phase** | Excluded | Excluded | Excluded | Excluded | Excluded | | | **Use phase** | Excluded | Excluded | Excluded | Excluded | Excluded | | ||
| - | | **Technology** | FR-4, PET, paper, multilayer | FR-4 vs paper P-PCB | FR-4 single-layer | FR-4 PTH, all stackups | FR-4, 6Layers SMT | | + | | **Technology** | FR-4, PET, paper, multilayer | FR-4 single-layer | FR-4 vs paper P-PCB | FR-4 PTH, all stackups | FR-4, 6Layers SMT | |
| - | | **Key GWP hotspot** | Epoxy resin, layer count | Copper (O-PCB); silver (P-PCB) | + | | **Key GWP hotspot** | Epoxy resin, layer count | Etching (FAETP, ODP); copper in board fab | Copper (O-PCB); silver (P-PCB) | Electricity consumption (~86% of GHG) | Electricity (~45% GWP) | |
| | **GWP order of magnitude** | ~50–500 kg CO₂eq/m² | 18.6 kg CO₂e/m² | 39.2 kg CO₂e/m² (O-PCB) | 60–200 kg CO₂eq/m² (company range) | 200 kg CO2eq/m² | | | **GWP order of magnitude** | ~50–500 kg CO₂eq/m² | 18.6 kg CO₂e/m² | 39.2 kg CO₂e/m² (O-PCB) | 60–200 kg CO₂eq/m² (company range) | 200 kg CO2eq/m² | | ||