Differences

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--- pcb_manufacturing [2026/04/08 13:43] – [1.2. cut of copper clade laminate (CCL) sheet to the required size] sophie
+++ pcb_manufacturing [2026/04/14 16:17] (current) – [2.4. developpment] sophie
@@ Line 5: / Line 5: @@
 {{:capture_d_ecran_2026-04-08_113838.png?direct&400}}
-It is important to note that this flow is adapted depending on the type of PCB (single sided, double sided, or multilayer). See the image below to have a better understanding of the differences in process flows [(https://www.mclpcb.com/blog/pcb-manufacturing-process/)].
+It is important to note that this flow is adapted depending on the type of PCB (single sided, double sided, or multilayer).
-{{:capture_d_ecran_2026-04-08_114444.png?direct&600}}
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 t
 ## 0. substrate/board fabrication
 ## 1. board cutting
-### 1.1. sharp edges remova
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
-l
+| sharp edge removal| soften the edges of the board | CCL sheet (copper sheets + glass fiber impregnated by resin), energy for equipment functionning |  |
-### 1.2. cut of copper clade laminate (CCL) sheet to the required size
+| cutting | cut the CCL sheet to the required size |  |  |
-inputs:
-  * CCL sheet (copper sheets + glass fiber impregnated by resin)
-  * energy for equipment functionning
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@@ Line 32: / Line 26: @@
 ^ Process steps ^ Process description ^ Inputs ^ Outputs ^
-| cleaning | remove impurities and increase copper roughness |  |  |
+| cleaning | remove impurities and increase copper roughness | acidic cleaners, water | acidic cleaners mixed with water |
-| drying| blow dry |  |  |
+| drying| blow dry | N2 gas | N2 gas |
 g
 ### 2.2. dry photosensitive film lamination
-applying the resist film on the pane
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+| resist film application on the panel  |  lamination in clean room environment  | liquid photoresist on PET film and covered by a PE film, water (+ other chemicals to improve pattern clarity and enhance stability of the film) ((Pour coller en dehors de Nextcloud Office, veuillez d'abord cliquer sur le bouton « télécharger »)) ((https://www.nokgrp.com/en/assets/images/sustainability/archive/2022/esg_databook_2022_en.pdf))  |   N-butyl acrylate and other chemicals   |
 l
 ### 2.3. UV ray exposure
-exposing the photosensitive film to UV rays in a dust-free brown lighted room using a photomask
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+| resist exposure  |  exposition of some part of the phooresist through a photomask  |  UV light ((https://eshop.dpsk.sk/files/riston200.pdf)), photomask (optical-grade quartz or soda-lime glass with sputtered chrome layer, silver-halide emulsion-coated polyester film)  |  TBA  |
+k
 ### 2.4. developpment
-removing unexposed photosensitive film
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+| removing unexposed photosensitive film |   |   Potassium carbonate K2CO3 aqueous solution sprayed onto the substrate or sodium carbonate Na2CO3 (the latter one seems the most used one). Or sodium metasilicate Na2SiO3 CAS6834-92-0  ((https://eshop.dpsk.sk/files/riston200.pdf)) ((http://pcbfab.com/developing)) ((https://www.dakenchem.com/photoresist-dry-film/)), DI water| |
+m
 ### 2.5. etching
-removing the unwanted copper around parts protected by the photosensitive film
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+| etching | removing the unwanted copper around parts protected by the photosensitive film  | amonia or chloride based etchants |  TBA  |
+m
 ### 2.6. stripping
-removing remaining photosentsitive film parts
----------------------------------------
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+|  stripping  |  removing remaining photosentsitive film parts  |  sodium hydroxide solution  |   TBA  |
+--------------------------------------
+-
 ## 3. optical inspection
 checking the conformity of the internal layer traces with the virtual design using optical system
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 ## 4. lamination
@@ Line 59: / Line 70: @@
 | oxidating | roughing and passivating copper |  |  |
 | stacking up | stack up core layers together, copper foil and pre-preg |  |  |
-| laminating | laminating all layers together |  |  |
+| laminating | laminating all layers together |  Prepreg, Copper foil, Aluminium plate |  |
-| cooling |
+| cooling |  |  |  |
+|  drilling position checking  |  checking drilling position to avoid misalignment  |  |  |
-  * oxidating: roughing and passivating copper
+|  edge routing  |  removing resin or copper foil that sticks out the board  |  |  |
-  * stacking up: stack up core layers together, copper foil and pre-preg
+|  edge milling  |  remove rough edges  |  |  |
-  * laminating: laminating all layers together
+|  visual checking  |  |  |  |
-  * cooling
-  * drilling position checking: checking drilling position to avoid misalignment
-  * edge routing: removing resin or copper foil that sticks out the board
-  * edge milling: remove rough edges
-  * visual checking
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 ## 5. drilling
-  * drilling a location  hole: drilling a hole to fix the board for further drilling and ensure allignment
-  * inserting pins: pins to maintain boards together
-  * drilling holes
-  * inspection: checking the alignment and the correct position of holes
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+|  drilling a location  hole  |  drilling a hole to fix the board for further drilling and ensure allignment  |  Aluminium sheet, Base sheet  |  TBA  |
+|  inserting pins  |   pins to maintain boards together  |  TBA  |  TBA  |
+|  drilling holes  |  |  Aluminium sheet, Base sheet  |  TBA  |
+|  inspection  |  checking the alignment and the correct position of holes  |  TBA  |  TBA  |
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+--------------------------------------
+-
 ## 6. electroless copper deposition
-  * cleaning: successive steps to remove dust, smear from drilling, etc.
-  * etching: pepare the surface for plating by modifying its surface properties
-  * activation: immersing the surface in catalyst colloid to attach it to the surface sites
+^ Process steps ^ Process description ^ Inputs ^ Outputs ^
+|  cleaning  |  successive steps to remove dust, smear from drilling, etc.  |  |  |
+|  etching  |  pepare the surface for plating by modifying its surface properties  |||
+|  activation  |  immersing the surface in catalyst colloid to attach it to the surface sites  |  |  |
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