Differences

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--- pcb_manufacturing [2026/05/29 12:29] – [17. tests and inspection] sophie
+++ pcb_manufacturing [2026/05/29 12:31] (current) – [15. surface finish] sophie
@@ Line 289: / Line 289: @@
 ## 15. surface finish
-The surface finish can either be ENIG (most common) or tin immersion (often chosen for applications using press fit pins).
+The surface finish can either be ENIG, tin immersion, or HASL. The ENIG surface finish is the most common one and tin immersion is often chosen for applications using press fit pins.
 **Electroless Nickel and Immersion Gold (ENIG) **
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 <figure center|legend>
 {{ :capture_d_ecran_2026-05-21_142815.png?direct |}}
-<caption> Nickel and gold depositions on the panel coated with solder mask by the ENIG process </caption>
+<caption> Nickel and gold depositions on the panel which is already coated with solder mask by the ENIG process </caption>
 </figure>
@@ Line 311: / Line 311: @@
 This type of surface finish is quite common as the surface is made of a material similar to the one used to solder the components. The first step is to clean to surface. Then, the panel is put into a molted solder bath (with a controlled content of copper): the solder attach itself to copper (which are the areas where solder is needed – other copper areas are covered by the solder mask). Then hot air is blowed onto the surface to remove any excess of solder. The PCB is then cleaned to remove any remaining solder solution.
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 ## 16. profile