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pcb_manufacturing [2026/06/05 16:51] – [15. Surface finish] mariepcb_manufacturing [2026/06/05 23:52] (current) – [2. Inner layer printing and etching] sophie
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 ** 2.4. Developpment ** ** 2.4. Developpment **
  
-In previous steps, specific parts of the resist film have been polymerized through UV light exposure. In this step, the unwanted part of the film (unexposed) will be removed to reveal the copper. It could be either an additive (the exposed part is removed) or a negative (unexposed areas are removed) development. Negative development is the most common method. +In previous steps, specific parts of the resist film have been polymerized through UV light exposure. In this step, the unwanted part of the film will be removed to reveal the copper. The development process can be described as either positive (the exposed resin is dissolved by the chemical developer) or negative (the unexposed resin is dissolved by the chemical developer). In PCB manufacturing, the negative development process is predominantly used. 
  
  
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 **V-socre** **V-socre**
  
-Rotating blade on the upper and lower part of the panel creating a “V-shape” pattern where we want the separation of two PCB to be. The depth of the V-shaped lines is closely controlled. +Rotating blade on the upper and lower part of the panel creating a “V-shape” pattern where we want the separation of two PCB to be. The depth of the V-shaped lines is closely controlled. The separation itself will be performed later in the supply chain.
  
 ** Routing** ** Routing**
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 **17.1. Electrical test** **17.1. Electrical test**
  
-This step is important to check if the circuit has the right connexions: we are looking for any unexpected short- or open-circuit that would translate a wrong functioning of the PCB. Two method exists to do so: the flying probe test (suitable for smaller volumes and prototypes: each electrical net is tested individually) and the bed of nail or fixture machine (suitable for large batches: all electrical nets are tested simultaneously). The 4-wire kelvin test can also be conducted, in addition of the previous one to check net continuity and resistance. +This step is important to check if the circuit has the right connections: we are looking for any unexpected short- or open-circuit that would translate to a wrong functioning of the PCB. Two method exists to do so: the flying probe test (suitable for smaller volumes and prototypes: each electrical net is tested individually) and the bed of nail or fixture machine (suitable for large batches: all electrical nets are tested simultaneously). The 4-wire kelvin test can also be conducted, in addition of the previous one, to check net continuity and resistance.
  
 ** 17.2. Final inspection** ** 17.2. Final inspection**
  
-Then each PCB must be inspected to check that there are no remaining defaults in their functioning. Visual checking and and a wide range of other tests are performed to identify any remaining damage on the board. +Then each PCB must be inspected to check that there are no remaining defaults in their functioning. Visual checking and a wide range of other tests are performed to identify any remaining defect on the board. 
  
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