Differences

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--- pcb_manufacturing [2026/06/05 16:55] – [17. Tests and inspection] marie
+++ pcb_manufacturing [2026/06/05 23:52] (current) – [2. Inner layer printing and etching] sophie
@@ Line 36: / Line 36: @@
 ** 2.4. Developpment **
-In previous steps, specific parts of the resist film have been polymerized through UV light exposure. In this step, the unwanted part of the film (unexposed) will be removed to reveal the copper. It could be either an additive (the exposed part is removed) or a negative (unexposed areas are removed) development. Negative development is the most common method.
+In previous steps, specific parts of the resist film have been polymerized through UV light exposure. In this step, the unwanted part of the film will be removed to reveal the copper. The development process can be described as either positive (the exposed resin is dissolved by the chemical developer) or negative (the unexposed resin is dissolved by the chemical developer). In PCB manufacturing, the negative development process is predominantly used.
@@ Line 325: / Line 325: @@
 ** 17.2. Final inspection**
-Then each PCB must be inspected to check that there are no remaining defaults in their functioning. Visual checking and a wide range of other tests are performed to identify any remaining damage on the board.
+Then each PCB must be inspected to check that there are no remaining defaults in their functioning. Visual checking and a wide range of other tests are performed to identify any remaining defect on the board.
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