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| screen_manufacturing [2026/05/29 18:01] – [7. Frame Assembly] sophie | screen_manufacturing [2026/06/01 01:17] (current) – [5. pixel fabrication] sophie | ||
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| Once the glass substrates are ready, the next step depends on the kind of thin film transistor (TFT) backplane technology that is being employed. The TFT backplane is the electronic controller for the display and controls individual pixels within the display. There are several types of TFT backplanes such as amorphous silicon (a-Si), indium gallium zinc oxide (IGZO), low temperature polysilicon (LTPS), and low temperature polyoxide (LTPO). | Once the glass substrates are ready, the next step depends on the kind of thin film transistor (TFT) backplane technology that is being employed. The TFT backplane is the electronic controller for the display and controls individual pixels within the display. There are several types of TFT backplanes such as amorphous silicon (a-Si), indium gallium zinc oxide (IGZO), low temperature polysilicon (LTPS), and low temperature polyoxide (LTPO). | ||
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| - | ## Transistor technology | ||
| - | #### Amorphous silicon (a-Si) | ||
| - | Amorphous silicon (a-Si) is the most mature and widely used backplane technology due to its straightforward manufacturing and scalability to massive substrate sizes. It involves depositing an unorganized silicon film via plasma-enhanced chemical vapor deposition (PECVD), which is highly cost-effective. While it is excellent for general applications, | ||
| - | [( Flay_Panel_Display_Manufacturing> | ||
| - | #### Indium-galium-zinc oxide (IGZO) | + | --- |
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| - | IGZO, being a metal oxide semiconductor, | + | |
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| - | #### Low-temperature polycrystalline silicon (LTPS) | + | |
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| - | Low-temperature polycrystalline silicon (LTPS) is a high-performance backplane technology mainly used in premium smartphones and mobile devices. It is produced by using excimer laser annealing (ELA) to transform amorphous silicon into a highly organized crystalline structure. This results in very high electron mobility (often >100 cm²/Vs), allowing for much smaller transistors and the integration of complex circuits directly on the glass [( Flay_Panel_Display_Manufacturing> | + | |
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| - | #### Low-temperature polycrystalline oxide (LTPO) | + | |
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| - | Low-temperature polycrystalline oxide (LTPO) is an advanced hybrid backplane technology that combines LTPS and oxide TFT technologies on the same substrate. LTPS transistors handle fast switching and processing tasks, while oxide transistors are used for pixel driving because they consume very little power. This combination allows displays to adjust refresh rates dynamically, | + | |
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| - | ### Manufacturers | + | |
| - | + | ||
| - | - Samsung Display and LG Display are the dominant global producers of LTPS backplanes for high-resolution mobile devices and flexible OLEDs | + | |
| - | - Sharp Corporation is famous for the commercialization of IGZO (Oxide TFTs), applying it to their high-resolution LCDs and specialized handheld panels | + | |
| - | - BOE Technology Group mass-produces large panels using both Oxide TFTs for 8K televisions and LTPS for advanced mobile applications | + | |
| - | - AU Optronics (AUO) has established production lines for both technologies to compete in premium monitor and notebook segments | + | |
| - | - Sony and Panasonic have historically developed Oxide backplanes for large OLED TV prototypes and high-transmittance IPS monitors | + | |
| - | - For LTPO technology, Samsung and LG are currently the primary suppliers for high-end consumer electronics manufacturers | + | |
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| ## 0. Glass substrate fabrication | ## 0. Glass substrate fabrication | ||
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| + | ------------ | ||
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| ## LCD screen manufacturing | ## LCD screen manufacturing | ||
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| #### anode fabrication | #### anode fabrication | ||
| + | The anode is formed on the substrate and the pixel control circuit. In the case of bottom-emission, | ||
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| + | <figure center|anodefab> | ||
| {{ : | {{ : | ||
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| #### bank fabrication | #### bank fabrication | ||
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| An organic insulator film is used to set apart different colors with a blank layer, and to prevent short circuit between the electrodes. The organic insulator film should be selected among those materials that would not absorb moisture and that show minimum outgassing [([[https:// | An organic insulator film is used to set apart different colors with a blank layer, and to prevent short circuit between the electrodes. The organic insulator film should be selected among those materials that would not absorb moisture and that show minimum outgassing [([[https:// | ||
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| The processes used for deposition of the cathode are either **vacuum thermal evaporation combined with an FMM** (Fine Metal Mask)[([[https:// | The processes used for deposition of the cathode are either **vacuum thermal evaporation combined with an FMM** (Fine Metal Mask)[([[https:// | ||
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| ### 6. Encapsulation | ### 6. Encapsulation | ||
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| ## 7. Frame Assembly | ## 7. Frame Assembly | ||