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--- screen_manufacturing [2026/07/06 16:40] – [1. Array process] yusufabdillah
+++ screen_manufacturing [2026/07/06 17:04] (current) – [4. Module process] yusufabdillah
@@ Line 65: / Line 65: @@
 #### Photolithography
-This repetitive process transfers precise circuit patterns from a photomask to the thin films deposited on the glass [(Bitard, Léa. Development of parametric model for Life Cycle Assessment of digital displays. 2025. EPFL, Master thesis)]. It begins with thorough cleaning of the substrate surface to remove contaminants, followed by the application of an adhesion promoter such as hexamethyldisilazane (HMDS) to improve the adhesion between the substrate and the photoresist (PR). A uniform photoresist layer is then spin-coated onto the substrate, after which it undergoes a pre-bake (soft bake) to evaporate residual solvents and stabilize the resist. The photoresist is subsequently exposed to UV light through a patterned photomask, causing selective chemical changes in the exposed regions. For a positive photoresist, the exposed regions become soluble and are removed during the development process, leaving behind the desired resist pattern. A post-bake (hard bake) is then performed to strengthen the remaining photoresist and improve its resistance to subsequent processing. This hardened PR pattern serves as a protective mask during the etching process, where the exposed regions of the underlying thin film are removed[( Flay_Panel_Display_Manufacturing>[[https://www.wiley.com/en-es/Flat+Panel+Display+Manufacturing-p-9781119161363|Flat Panel Display Manufacturing, Jun Souk, Shinji Morozumi, Fang-Chen Luo, Ion Bita, 2018]])]. Finally, the remaining photoresist is stripped away (resist removal), leaving only the patterned thin-film layer on the substrate. Depending on the fabrication process, the patterned photoresist may also serve as a mask for ion implantation or doping instead of etching.
+This repetitive process transfers precise circuit patterns from a photomask to the thin films deposited on the glass [(Bitard, Léa. Development of parametric model for Life Cycle Assessment of digital displays. 2025. EPFL, Master thesis)]. It begins with substrate cleaning to eliminate all contaminants from its surface, Next step involves coating the substrate surface with an adhesion promoter such as hexamethyldisilazane (HMDS), which improves bonding between substrate and photoresist (PR). A photoresist layer is uniformly coated with spinning, which is later on subjected to a pre-bake treatment (soft bake) in order to evaporate solvents and stabilize resist. In the next step, the photoresist is subjected to exposure to ultraviolet radiation using a patterned photomask. There occur chemical changes in the exposed areas of the photoresist. For a positive photoresist, the exposed regions become soluble and are removed during the development process, leaving behind the desired resist pattern. Post-baking (hard bake) is carried out in order to make the remaining photoresist strong and resistant to the upcoming processes. This hardened PR pattern acts as a protective mask during the etching process, where the exposed regions of the underlying thin film are removed[( Flay_Panel_Display_Manufacturing>[[https://www.wiley.com/en-es/Flat+Panel+Display+Manufacturing-p-9781119161363|Flat Panel Display Manufacturing, Jun Souk, Shinji Morozumi, Fang-Chen Luo, Ion Bita, 2018]])]. Finally, the remaining photoresist is stripped away (resist removal), leaving only the patterned thin-film layer on the substrate. Depending on the fabrication process, the patterned photoresist may also serve as a mask for ion implantation or doping instead of etching.
 <figure center |photolithography>
@@ Line 152: / Line 152: @@
 ### 4. Module process
-#### Polarizer Lamination
+#### Polariser Lamination
-Flexible linear polarizer sheets are attached to the outer surfaces of the assembled LCD cell. These films transmit light of a specific polarization axis while absorbing orthogonal components to modulate display brightness. These polarizer films are made from an oriented PVA film containing iodine dye, which is then laminated between two TAC layers. At the very surface, a protective film is applied to avoid any mechanical damage during handling and operation. Below this protective film, there is an additional functional film which can be any type like AG (Anti-Glare), LR (Low Reflection), AR (Anti-Reflection), or HC (Hard-Coat). The back side has an adhesive film that adheres the polarizer with LCD cell, whereas a release film covers this adhesive film before installation. It is essential that the direction of polarization is carefully controlled to align with the direction of orientation of the LC cells.
+Flexible linear polariser sheets are attached to the outer surfaces of the assembled LCD cell. These films transmit light of a specific polarization axis while absorbing orthogonal components to modulate display brightness. These polariser films are made from an oriented PVA film containing iodine dye, which is then laminated between two TAC layers. At the very surface, a protective film is applied to avoid any mechanical damage during handling and operation. Below this protective film, there is an additional functional film which can be any type like AG (Anti-Glare), LR (Low Reflection), AR (Anti-Reflection), or HC (Hard-Coat). The back side has an adhesive film that adheres the polariser with LCD cell, whereas a release film covers this adhesive film before installation. It is essential that the direction of polarisation is carefully controlled to align with the direction of orientation of the LC cells.
 <figure center |polarizer lamination>