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2026/06/05 23:52 pcb_manufacturing – [2. Inner layer printing and etching] sophie -1 B (current)
2026/06/05 23:51 pcb_manufacturing – [2. Inner layer printing and etching] sophie +94 B
2026/06/05 16:55 pcb_manufacturing – [17. Tests and inspection] marie ±0 B
2026/06/05 16:55 pcb_manufacturing – [17. Tests and inspection] marie ±0 B
2026/06/05 16:53 pcb_manufacturing – [16. Profile] marie +66 B
2026/06/05 16:51 pcb_manufacturing – [15. Surface finish] marie +2 B
2026/06/05 16:50 pcb_manufacturing – [15. Surface finish] marie +2 B
2026/06/05 16:49 pcb_manufacturing – [15. Surface finish] marie +2 B
2026/06/05 16:40 pcb_manufacturing – [13. Solder mask] marie +3 B
2026/06/05 16:33 pcb_manufacturing – [13. Solder mask] marie +18 B
2026/06/05 16:25 pcb_manufacturing – [12. Optical inspection] marie -1 B
2026/06/05 16:25 pcb_manufacturing – [11. Outer layer etching] marie +8 B
2026/06/05 16:23 pcb_manufacturing – [10. Plating] marie +3 B
2026/06/05 16:20 pcb_manufacturing – [9. Outer layer imaging] marie +12 B
2026/06/05 16:17 pcb_manufacturing – [8. Back-drilling (optional)] marie -2 B
2026/06/05 16:17 pcb_manufacturing – [7. Plating (optional)] marie -47 B
2026/06/05 16:12 pcb_manufacturing – [6. Electroless copper deposition] marie -5 B
2026/06/05 16:07 pcb_manufacturing – [5. Drilling] marie +7 B
2026/06/05 16:04 pcb_manufacturing – [5. Drilling] marie +24 B
2026/06/05 15:59 pcb_manufacturing – [4. Lamination] marie +9 B