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intro_optical_sensor [2026/06/05 14:43] – [Definition] mathieu.ludden.extintro_optical_sensor [2026/06/30 11:40] (current) – [Life Cycle - Inventory] antoine
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 An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods. An optical sensor is a device that detects and converts light rays into electrical signals, allowing it to measure different physical properties such as distance, brightness, motion, temperature and pressure via optical methods.
  
-The global optical sensor market was worth around \$25–28 billion in 2025 and is expected to reach approximately \$71.7 billion by 2035[(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])]. This increase is directly linked to progress in automation, imaging and environmental monitoring technologies, as well as to the needs of the automotive, medical and industrial sectors. +The global optical sensor market was worth around \$25–28 billion in 2025 and is expected to reach approximately \$71.7 billion by 2035 [(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])]. This increase is directly linked to progress in automation, imaging and environmental monitoring technologies, as well as to the needs of the automotive, medical and industrial sectors. 
  
  
  
-=== What is it used for? ===+==== Function ====
  
  
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-=== Are there different types/technologies? ===+==== Different technologies ====
  
  
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 They can also be applied to non-imaging sensors technology, such as passive infrared sensors (PIR) for motion detection, gas sensors, spectroscopy detectors and more.  They can also be applied to non-imaging sensors technology, such as passive infrared sensors (PIR) for motion detection, gas sensors, spectroscopy detectors and more. 
  
 +[comment]: <> (
 ===  If different types, what are the differences in terms of materials, process, use consumption? === ===  If different types, what are the differences in terms of materials, process, use consumption? ===
  
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 //Question à poser plutôt dans la page wiki d'une famille de capteur optique ex: Image sensors ==> Difference entre [[intro_cmos|CMOS]]/CCD.//  //Question à poser plutôt dans la page wiki d'une famille de capteur optique ex: Image sensors ==> Difference entre [[intro_cmos|CMOS]]/CCD.// 
  
-===  Is there a generic component that represents a family of components? ===+) 
 + 
 +====  Focus ====
  
  
 This study will focus on image sensors, which dominate the market for optical sensors[(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])] and are used in many applications, including consumer electronics, automotive camera systems, industrial machine vision, and medical imaging.  This study will focus on image sensors, which dominate the market for optical sensors[(Optical_sensor_market > [[https://www.gminsights.com/industry-analysis/optical-sensor-market]])] and are used in many applications, including consumer electronics, automotive camera systems, industrial machine vision, and medical imaging. 
  
 +<figure center |optical_sensor_market>
 {{ :0:global-optical-sensor-market-size-by-product-type-2022-2035-usd-billion.webp |}} {{ :0:global-optical-sensor-market-size-by-product-type-2022-2035-usd-billion.webp |}}
 +<caption>Optical sensor market size by product type </caption>
 +</figure>
  
- +==== Sub-parts  ====
-=== How many sub-parts does the system consist of? ===+
  
  
 The main parts of a [[intro_cmos|CMOS]] image sensor are the following: The main parts of a [[intro_cmos|CMOS]] image sensor are the following:
  
-* Sensor chip (wafer, node = 40-180nm): An array of photosensitive pixels, with Bayer pattern +* Microlens : Focus the light and direct it to the photodiode 
-* Wire bonds +* Color filter : Designate light colors 
-* Package +* Photodiode : Absorbs the light and converts it into an electrical charge 
-* Cover glass +* Transisors : Control the signal flow and processing 
-* Contact pads+* Package : Protect the chip and provide connections to the electronics that will use the image. 
  
 +<figure center |CMOS>
 {{:capture_d_ecran_2026-02-04_171919.png?400|}} {{:capture_d_ecran_2026-02-04_171919.png?400|}}
  
 {{:capture_d_ecran_2026-02-18_130801.png?400|}} {{:capture_d_ecran_2026-02-18_130801.png?400|}}
 +<caption> CMOS </caption>
 +</figure>
  
-Interesting sources : +Sources [(understanding_image_sensor > [[https://thinklucid.com/tech-briefs/understanding-digital-image-sensors/ |Blog post - Thinklucid]])]  [(what_is_cmos_image_sensor > [[https://www.ansys.com/simulation-topics/what-is-cmos-image-sensor |Blog post - Ansys]])] [(scaling_cmos_image_sensor > [[https://semiengineering.com/scaling-cmos-image-sensors/#:~:text=Today%2C%20Sony%20is%20the%20largest%20supplier%20of,image%20sensors%2C%20followed%20by%20Samsung%20and%20OmniVision |Scaling CMOS Image Sensors]])] [(electronique_imagerie_101 > [[https://www.edmundoptics.fr/knowledge-center/application-notes/imaging/understanding-camera-sensors-for-machine-vision-applications/ | Électronique d'Imagerie 101 : Compréhension des Capteurs de Caméra pour les Applications de Vision Industrielle]])]
- +
-* [Blog post - Thinklucid](https://thinklucid.com/tech-briefs/understanding-digital-image-sensors/) +
-* [Blog post - Ansys](https://www.ansys.com/simulation-topics/what-is-cmos-image-sensor) +
-* [Scaling CMOS Image Sensors](https://semiengineering.com/scaling-cmos-image-sensors/#:~:text=Today%2C%20Sony%20is%20the%20largest%20supplier%20of,image%20sensors%2C%20followed%20by%20Samsung%20and%20OmniVision) +
-* [Électronique d'Imagerie 101 : Compréhension des Capteurs de Caméra pour les Applications de Vision Industrielle](https://www.edmundoptics.fr/knowledge-center/application-notes/imaging/understanding-camera-sensors-for-machine-vision-applications/)+
  
 ====  Perimeter ==== ====  Perimeter ====
  
-===  What is included? ===+===  Included ===
  
  
-Focus on the optical sensor.+This study will focus on the CMOS optical sensor.
  
  
-===  What is excluded? ===+===  Excluded ===
  
  
-Exclusion of other sensors like the distance sensor to adjust the focus. +Exclusion of other sensors such as Photoelectric sensors, Active ranging sensor modules, Infrared sensors, etc.
-Exclusion of the rest of the image-processing system (PCB, controllers, etc.).+
  
-Exclusion of laser sensor and IR sensors. Not the focus for now+Exclusion of the component for the image-processing system (PCB, controllers, etc.).
  
 ==== Functional unit and reference flows ==== ==== Functional unit and reference flows ====
  
  
-=== What is the functional unit? ===+=== Functional unit===
  
-TBC +"Manufacture of a CMOS image sensor"
-=== What are the reference flows? ===+
  
-TBC+=== Reference flow === 
 + 
 +One square meter of CMOS image censor.
  
  
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 ==== Streamlined Models of CMOS Image Sensors Carbon Impacts ==== ==== Streamlined Models of CMOS Image Sensors Carbon Impacts ====
 This section summarises the information from Weppe and Al's 2024 study.[([[https://ieeexplore.ieee.org/abstract/document/10741688|O. Weppe, J. Chossat, T. Marty, J. -C. Prévotet and M. Pelcat, "Streamlined Models of CMOS Image Sensors Carbon Impacts," 2024 27th Euromicro Conference on Digital System Design (DSD), Paris, France, 2024, pp. 250-257, doi: 10.1109/DSD64264.2024.00041]])] This section summarises the information from Weppe and Al's 2024 study.[([[https://ieeexplore.ieee.org/abstract/document/10741688|O. Weppe, J. Chossat, T. Marty, J. -C. Prévotet and M. Pelcat, "Streamlined Models of CMOS Image Sensors Carbon Impacts," 2024 27th Euromicro Conference on Digital System Design (DSD), Paris, France, 2024, pp. 250-257, doi: 10.1109/DSD64264.2024.00041]])]
 +
 +\\
 +
 +
 === Methodology === === Methodology ===
 Streamlined GHG emission model based on a linear relationship between silicon die surface area and Global Warming Potential (GWP), expressed in gCO<sub>2</sub>eq. The model follows: Streamlined GHG emission model based on a linear relationship between silicon die surface area and Global Warming Potential (GWP), expressed in gCO<sub>2</sub>eq. The model follows:
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 The value of K<sub>i</sub> and E<sub>i</sub> are taken from [([[http://link.springer.com/10.1007/978-1-4419-9988-7|S. B. Boyd, Life-Cycle Assessment of Semiconductors. New York, NY: Springer, 2012.]])] The value of K<sub>i</sub> and E<sub>i</sub> are taken from [([[http://link.springer.com/10.1007/978-1-4419-9988-7|S. B. Boyd, Life-Cycle Assessment of Semiconductors. New York, NY: Springer, 2012.]])]
 +
 +\\
 +
 +
 === Types of Technologies Covered (System Definition) === === Types of Technologies Covered (System Definition) ===
 CMOS Image Sensor (CIS). Parameters affecting the scope: CMOS Image Sensor (CIS). Parameters affecting the scope:
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 * Pixel size → sensor size * Pixel size → sensor size
 * Stacking * Stacking
 +
 +\\
 +
 === Life Cycle Stages Covered === === Life Cycle Stages Covered ===
 * Silicon die fabrication * Silicon die fabrication
 * Electricity consumption over lifespan * Electricity consumption over lifespan
 +
 +\\
 +
 === Fluxes Included in the Scope === === Fluxes Included in the Scope ===
 Generic semiconductor data for a CIS. The following are excluded: Generic semiconductor data for a CIS. The following are excluded:
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 * Color filter array * Color filter array
 * Other optical components * Other optical components
 +
 +\\
 +
 === Main Results === === Main Results ===
 Known hotspots : silicon die manufacturing, electricity consumption over lifespan, 2D/3D die stacking (factor 2 difference) Known hotspots : silicon die manufacturing, electricity consumption over lifespan, 2D/3D die stacking (factor 2 difference)
 {{ ::comparasaion_gwp_proposed_models.png?direct&400 |https://ieeexplore.ieee.org/abstract/document/10741688}} {{ ::comparasaion_gwp_proposed_models.png?direct&400 |https://ieeexplore.ieee.org/abstract/document/10741688}}
 +
 +\\
 +
 === Limitations === === Limitations ===
 Uses generic semiconductor data for a CIS, and therefore does not account for the specificities of CMOS image sensors, such as the lens, the color filter array, or other optical components. Uses generic semiconductor data for a CIS, and therefore does not account for the specificities of CMOS image sensors, such as the lens, the color filter array, or other optical components.
  
  
-=====  Life Cycle - Inventory =====+=====  Life Cycle - Inventory (⚠️WORK IN PROGRESS⚠️)=====
    
  
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 => Goal: Define state of the art on life cycle stages to be considered. => Goal: Define state of the art on life cycle stages to be considered.
  
-[comment]: <> (+
 ==== Database and tools ==== ==== Database and tools ====
  
-===  What are the already existing data (dataset, parametric model, paper, etc.)? ===+===  Already existing data ===
  
 TBC TBC
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 => Goal: List the technical information needed for the LCI. => Goal: List the technical information needed for the LCI.
  
 +[comment]: <> (
 ===  What is it made of? === ===  What is it made of? ===
  
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 TBC TBC
 +)
  
 \\ \\
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 TBC TBC
-===  For each process, what are the inputs (water, chemicals, etc.) ? ===+===  For each process, what are the inputs : water, chemicals, etc. ? ===
  
 TBC TBC
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 TBC TBC
  
-=== How the “main” manufacturers can be characterized: by the number of components manufactured, the market share (€), other? ===+=== How the “main” manufacturers can be characterized: by the number of components manufactured, the market share in €, other? ===
  
  
 Source of market information : https://www.fortunebusinessinsights.com/optical-sensors-market-102097 Source of market information : https://www.fortunebusinessinsights.com/optical-sensors-market-102097
 +)
  
-===  Who are the main manufacturers? Where are they located?===+===  Main manufacturers ===
  
 * Sony corporation (Japan, Integrated Device Manufacturer (IDM)) * Sony corporation (Japan, Integrated Device Manufacturer (IDM))
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 => Goal: List the technical information needed for the LCI. => Goal: List the technical information needed for the LCI.
  
 +[comment]: <> (
 === What are the packaging? Made of which materials? === === What are the packaging? Made of which materials? ===
  
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 TBC TBC
 +)
  
 ==== Use ==== ==== Use ====
  
-=> Goal: List the technical information needed for the LCI.+Not in the scope
  
-===  What is the service lifespan? (durée d'utilisation) === 
- 
-TBC 
-=== Is there a reparation factor? === 
- 
-TBC 
-===  Is there sub-parts replacement? === 
- 
-TBC 
- 
-===  Where is it used? === 
- 
-TBC 
-=== Who are the users? === 
- 
-TBC 
-=== Which + how much energy does it need? === 
- 
-TBC 
-===  Is there emissions from use? === 
- 
-TBC 
 ====  End of life ==== ====  End of life ====
  
-=> Goal: List the technical information needed for the LCI. +Not in the scope
- +
-=== What is the lifetime? (durée de vie) === +
- +
-TBC +
-=== Is it different from lifespan and why? === +
- +
-TBC +
-===  Is it refurbished? + Where? === +
- +
-TBC +
-===  Is it recyclable? Can it be dismantled? Which material can be separated? + Where and how? === +
- +
-TBC +
-===  Is it incinerated with energy recovery? Just incinerated? Buried? + Where? === +
- +
-TBC +
-===  Which part of waste can be considered as mismanaged (neither recycled, nor incinerated, nor buried)? === +
- +
-TBC +
- +
- +
- +
-)+
  
 \\ \\